Patterning method, patterning apparatus, and method for manufacturing semiconductor device

Abstract

A patterning method includes supplying an imprint material made of a dielectric in an uncured state onto a workpiece, producing a potential difference between the workpiece and a conductive pattern portion of a template opposed to the workpiece to induce dielectric polarization in the imprint material before curing the imprint material, bringing the pattern portion into contact with the imprint material in the uncured state, curing the imprint material with the pattern portion brought into contact with the imprint material, and stripping the template from the imprint material after curing the imprint material.

1 . A patterning method comprising:
 supplying an imprint material made of a dielectric in an uncured state onto a workpiece;   producing a potential difference between the workpiece and a conductive pattern portion of a template opposed to the workpiece to induce dielectric polarization in the imprint material before curing the imprint material;   bringing the pattern portion into contact with the imprint material in the uncured state;   curing the imprint material with the pattern portion brought into contact with the imprint material; and   stripping the template from the imprint material after curing the imprint material.   
     
     
         2 . The method according to  claim 1 , wherein the potential difference is produced between the workpiece and the pattern portion by applying a voltage to one of the workpiece and the pattern portion and grounding the other. 
     
     
         3 . The method according to  claim 1 , wherein the potential difference is produced between the workpiece and the pattern portion by applying a voltage to one of the workpiece and the pattern portion and applying a voltage of a second polarity opposite to a first polarity of the voltage applied to the one to the other. 
     
     
         4 . The method according to  claim 1 , wherein an electric field in a direction opposite to the electric field producing the potential difference is produced between the pattern portion and the workpiece immediately before the template is stripped from the imprint material. 
     
     
         5 . The method according to  claim 4 , wherein the potential difference produced is maintained until switching to the electric field in the opposite direction after the potential difference is produced between the workpiece and the pattern portion. 
     
     
         6 . The method according to  claim 1 , wherein the potential difference starts to be produced between the workpiece and the pattern portion before the pattern portion comes into contact with the imprint material. 
     
     
         7 . The method according to  claim 1 , wherein the template is stripped from the imprint material with the potential difference eliminated. 
     
     
         8 . The method according to  claim 1 , wherein the pattern portion is formed in a DLC (diamond-like carbon) film. 
     
     
         9 . The method according to  claim 1 , wherein
 the imprint material is an ultraviolet-curable resin, and   the template is transparent to ultraviolet radiation.   
     
     
         10 . A patterning apparatus comprising:
 a workpiece holder capable of holding a workpiece;   a template holder capable of holding a template including a conductive pattern portion;   a contact probe connected to a power supply and being capable of moving relative to the pattern portion to come into contact therewith;   a moving mechanism configured to cause the workpiece holder and the template holder to move close to each other to bring the pattern portion into contact with an imprint material made of a dielectric in an uncured state supplied onto the workpiece, and to cause the workpiece holder and the template holder to move away from each other after the imprint material is cured; and   a controller configured to apply a voltage to the pattern portion through the contact probe in contact with the pattern portion before the imprint material is cured.   
     
     
         11 . The apparatus according to  claim 10 , wherein after the imprint material is cured and immediately before the template is stripped from the imprint material, the controller applies a voltage of a second polarity opposite to a first polarity of the voltage applied before the imprint material is cured to the pattern portion through the contact probe. 
     
     
         12 . A method for manufacturing a semiconductor device, comprising:
 supplying an imprint material made of a dielectric in an uncured state onto a workpiece;   producing a potential difference between the workpiece and a conductive pattern portion of a template opposed to the workpiece to induce dielectric polarization in the imprint material before curing the imprint material;   bringing the pattern portion into contact with the imprint material in the uncured state;   curing the imprint material with the pattern portion brought into contact with the imprint material;   stripping the template from the imprint material after curing the imprint material; and   processing the workpiece by using the imprint material from which the template has been stripped as a mask.   
     
     
         13 . The method according to  claim 12 , wherein the potential difference is produced between the workpiece and the pattern portion by applying a voltage to one of the workpiece and the pattern portion and grounding the other. 
     
     
         14 . The method according to  claim 12 , wherein the potential difference is produced between the workpiece and the pattern portion by applying a voltage to one of the workpiece and the pattern portion and applying a voltage of a second polarity opposite to a first polarity of the voltage applied to the one to the other. 
     
     
         15 . The method according to  claim 12 , wherein an electric field in a direction opposite to the electric field producing the potential difference is produced between the pattern portion and the workpiece immediately before the template is stripped from the imprint material. 
     
     
         16 . The method according to  claim 15 , wherein the potential difference produced is maintained until switching to the electric field in the opposite direction after the potential difference is produced between the workpiece and the pattern portion. 
     
     
         17 . The method according to  claim 12 , wherein the potential difference starts to be produced between the workpiece and the pattern portion before the pattern portion comes into contact with the imprint material. 
     
     
         18 . The method according to  claim 12 , wherein the template is stripped from the imprint material with the potential difference eliminated. 
     
     
         19 . The method according to  claim 12 , wherein the pattern portion is formed in a DLC (diamond-like carbon) film. 
     
     
         20 . The method according to  claim 12 , wherein
 the imprint material is an ultraviolet-curable resin, and   the template is transparent to ultraviolet radiation.