Integrated electronic components and methods of formation thereof

Abstract

Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

1 . An integrated electronic component, comprising:
 an electronic device; and   a microstructure formed by a sequential build process, wherein the microstructure comprises: a waveguide section comprising a plurality of waveguides, the waveguides each having a non-solid core volume within an outer conductor surrounding the core volume; and a transition structure coupling the waveguides to the electronic device.   
     
     
         2 . The integrated electronic component of  claim 1 , wherein the transition structure provides a heat-sink function. 
     
     
         3 . The integrated electronic component of  claim 1 , wherein the waveguides each comprise a center conductor and an outer conductor disposed around the center conductor, wherein the non-solid volume is disposed between the center conductor and the outer conductor. 
     
     
         4 . The integrated electronic component of  claim 1 , wherein the electronic device comprises an active device. 
     
     
         5 . The integrated electronic component of  claim 1 , wherein the electronic device comprises a passive device. 
     
     
         6 . The integrated electronic component of  claim 1 , wherein the electronic device is flip-chip mounted to the transition structure. 
     
     
         7 . The integrated electronic component of  claim 1 , wherein the transition structure comprises a pedestal disposed beneath the end portion of the center conductor. 
     
     
         8 . The integrated electronic component of  claim 1 , wherein the transition structure comprises a plurality of metal posts connected to a backsurface of the electronic device, and a front surface of the electronic device is electrically connected to the waveguides. 
     
     
         9 . A method of forming an integrated electronic component, comprising:
 providing an electronic device;   disposing a plurality of layers over a substrate, wherein the layers comprise one or more of dielectric, conductive and sacrificial materials; and   forming from the layers a microstructure comprising: a waveguide section comprising a plurality of waveguides, the waveguides each having a non-solid core volume within an outer conductor surrounding the core volume; and a transition structure coupling the waveguides to the electronic device.