Inventor · disambiguated record
Jean-Marc Rollin
Also filed as: ROLLIN JEAN-MARC
20 granted patents·5 pending applications·447 citations·filing 2008–2019
95Inventor score
Top patents by PatentIndex Score
25 records- 0198US8542079B2Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connectorSHERRER DAVID W·Filed 2011·Granted Sep 24, 2013·47 cites·31 claims
- 0298US7898356B2Coaxial transmission line microstructures and methods of formation thereofNUVOTRONICS LLC·Filed 2008·Granted Mar 1, 2011·92 cites·11 claims
- 0397US9065163B1High frequency power combiner/dividerNUVOTRONICS LLC·Filed 2012·Granted Jun 23, 2015·116 cites·17 claims
- 0497US8814601B1Batch fabricated microconnectorsSHERRER DAVID W·Filed 2012·Granted Aug 26, 2014·34 cites·55 claims
- 0595US9583856B2Batch fabricated microconnectorsNUVOTRONICS LLC·Filed 2014·Granted Feb 28, 2017·17 cites·8 claims
- 0693US9024417B2Integrated electronic components and methods of formation thereofNUVOTRONICS LLC·Filed 2013·Granted May 5, 2015·11 cites·32 claims
- 0792US8698577B2Three-dimensional microstructuresSHERRER DAVID·Filed 2011·Granted Apr 15, 2014·42 cites·32 claims
- 0890US10002818B2Integrated electronic components and methods of formation thereofNUVOTRONICS LLC·Filed 2015·Granted Jun 19, 2018·5 cites·18 claims
- 0990US9843084B2Three-dimensional microstructuresNUVOTRONICS INC·Filed 2016·Granted Dec 12, 2017·5 cites·12 claims
- 1090US7755174B2Integrated electronic components and methods of formation thereofNUVOTONICS LLC·Filed 2008·Granted Jul 13, 2010·56 cites·8 claims
- 1189US9306255B1Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each otherNUVOTRONICS LLC·Filed 2014·Granted Apr 5, 2016·7 cites·16 claims
- 1285US9490517B2High frequency power combiner/dividerNUVOTRONICS LLC·Filed 2015·Granted Nov 8, 2016·6 cites·15 claims
- 1385US9413052B2Three-dimensional microstructuresNUVOTRONICS LLC·Filed 2015·Granted Aug 9, 2016·3 cites·14 claims
- 1480US10193203B2Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systemsNUVOTRONICS INC·Filed 2018·Granted Jan 29, 2019·2 cites·19 claims
- 1570US9136575B2Three-dimensional microstructuresNUVOTRONICS LLC·Filed 2014·Granted Sep 15, 2015·1 cites·15 claims
- 1669US10361471B2Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systemsNUVOTRONICS INC·Filed 2016·Granted Jul 23, 2019·1 cites·15 claims
- 1763US2019277910A1Wafer Scale Test Interface Unit: Low Loss and High Isolation Devices and Methods for High Speed and High Density Mixed Signal Interconnects and ContactorsCUBIC CORP·Filed 2019·Application pending·0 cites
- 1863US2020076042A1Three-dimensional microstructuresCUBIC CORP·Filed 2019·Application pending·0 cites
- 1962US11342683B2Microwave/millimeter-wave waveguide to circuit board connectorCUBIC CORP·Filed 2019·Granted May 24, 2022·1 cites·27 claims
- 2062US10310009B2Wafer scale test interface unit and contactorsNUVOTRONICS INC·Filed 2015·Granted Jun 4, 2019·1 cites·21 claims
- 2159US10431521B2Integrated electronic components and methods of formation thereofNUVOTRONICS INC·Filed 2017·Granted Oct 1, 2019·0 cites·21 claims
- 2259US10305158B2Three-dimensional microstructuresNUVOTRONICS INC·Filed 2017·Granted May 28, 2019·0 cites·7 claims
- 2359US2019393580A1Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3d systemsNUVOTRONICS INC·Filed 2019·Application pending·0 cites
- 2451US2017170592A1Batch fabricated microconnectorsNUVOTRONICS INC·Filed 2017·Application pending·0 cites
- 2550US2010296252A1Integrated electronic components and methods of formation thereofROLLIN JEAN-MARC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →