Wafer Scale Test Interface Unit: Low Loss and High Isolation Devices and Methods for High Speed and High Density Mixed Signal Interconnects and Contactors

Abstract

Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates.

What is claimed is: 
     
         1 . A wafer level test interface device, comprising a contactor probe assembly having a housing with a plurality of passageways extending therethrough from a first surface of the housing to an opposing second surface of the housing, the housing comprised of a plurality of planar conductive strata adjoining one another, each stratum disposed parallel to the first surface of the housing, and comprising a plurality of conductive probes, each probe disposed in a receptive one of the passageways. 
     
     
         2 . The wafer level test interface device of  claim 1 , wherein the conductive probes have end portions that extend outward from the first surface of the probe assembly, and wherein the end portions are resiliently movable relative to the first surface of the probe assembly. 
     
     
         3 . The wafer level test interface device of  claim 2 , wherein the conductive probes have end portions that extend outward from the second surface of the probe assembly, and wherein the end portions are resiliently movable relative to the second surface of the probe assembly. 
     
     
         4 . The wafer level test interface device of  claim 1 , wherein the conductive probes comprise a spring. 
     
     
         5 . The wafer level test interface device of  claim 4 , wherein the spring is comprised of a plurality of layers of a conductive material. 
     
     
         6 . The wafer level test interface device of  claim 5 , wherein the spring comprises a “C”-shape. 
     
     
         7 . The wafer level test interface device of  claim 5 , wherein the spring comprises alternating “C”-shaped sections where each “C”-shaped section comprises a flexure. 
     
     
         8 . The wafer level test interface device of  claim 1 , wherein the passageways have respective ends spaced relative to one another at the first surface separated by a first distance and have respective ends spaced relative to one another at the second surface separated by a second distance which is larger than the first distance. 
     
     
         9 . A method of forming a wafer level test interface device comprising a contactor probe assembly by a sequential build process, comprising:
 sequentially depositing a plurality of strata on top of one another, wherein the plurality of strata comprises one or more layers of a conductive material and one or more layers of a sacrificial material, the plurality of strata collectively providing a housing with a plurality of passageways extending therethrough from a first surface of the housing to an opposing second surface of the housing, the housing comprised of a plurality of planar conductive strata adjoining one another, each stratum disposed parallel to the first surface of the housing; and,   providing a conductive probe in each of a receptive one of the passageways.   
     
     
         10 . The method of  claim 9 , wherein the conductive probes have end portions that extend outward from the first surface of the probe assembly, and wherein the end portions are resiliently movable relative to the first surface of the probe assembly. 
     
     
         11 . The method of  claim 10 , wherein the conductive probes have end portions that extend outward from the second surface of the probe assembly, and wherein the end portions are resiliently movable relative to the second surface of the probe assembly. 
     
     
         12 . The method of  claim 9 , wherein the conductive probes comprise a spring. 
     
     
         13 . The method of  claim 12 , wherein the spring is comprised of a plurality of layers of the conductive material. 
     
     
         14 . The wafer level test interface device of  claim 13 , wherein the spring comprises a “C”-shape. 
     
     
         15 . The method of  claim 13 , wherein the spring comprises alternating “C”-shaped sections where each “C”-shaped section comprises a flexure. 
     
     
         16 . The method of  claim 9 , wherein the passageways have respective ends spaced relative to one another at the first surface separated by a first distance and have respective ends spaced relative to one another at the second surface separated by a second distance which is larger than the first distance