Package and the Method for Making the Same, and a Stacked Package

Abstract

The present invention relates to a package and the method for making the same, and a stacked package. The method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.

1 . A stacked package, comprising:
 a first package element, comprising:
 a first molding compound, having a first surface, a second surface and a first accommodating groove, wherein the first accommodating groove penetrates the first molding compound; 
 a first die, disposed in the first accommodating groove and having a first surface, a second surface and at least one first via, wherein the first surface of the first die is exposed to the first surface of the first molding compound, the second surface of the first die is exposed to the second surface of the first molding compound; 
 a first upper circuit layer, disposed on the second surface of the first molding compound; and 
 a first lower circuit layer, disposed on the first surface of the first molding compound, and the first upper circuit layer electrically connected to the first lower circuit layer by the first via; and 
   a second package element, stacked on the first package element, and electrically connected to the first upper circuit layer.   
     
     
         2 . The stacked package as claimed in  claim 1 , wherein the first die further comprises a plurality of first ball pads disposed on the first surface of the first die. 
     
     
         3 . The stacked package as claimed in  claim 1 , further comprising a plurality of first solder balls disposed on the first lower circuit layer. 
     
     
         4 . The stacked package as claimed in  claim 1 , wherein the second package element comprises:
 a second molding compound, having a first surface, a second surface and a second accommodating groove, wherein the second accommodating groove penetrates the second molding compound;   a second die, disposed in the second accommodating groove and having a first surface, a second surface and at least one second via, wherein the first surface of the second die is exposed to the first surface of the second molding compound, and the second surface of the second die is exposed to the second surface of the second molding compound;   a second upper circuit layer, disposed on the second surface of the second molding compound; and   a second lower circuit layer, disposed on the first surface of the second molding compound, and the second upper circuit layer electrically connected to the second lower circuit layer by the second via, and the second lower circuit layer electrically connected to the first upper circuit layer.   
     
     
         5 . The stacked package as claimed in  claim 4 , wherein the second die further comprises a plurality of second ball pads disposed on the first surface of the second die. 
     
     
         6 . The stacked package as claimed in  claim 4 , further comprising a plurality of second solder balls disposed on the second lower circuit layer and connecting the first upper circuit layer. 
     
     
         7 . The stacked package as claimed in  claim 1 , wherein the first upper circuit layer comprises a first upper redistribution layer and the first lower circuit layer comprises a first lower redistribution layer. 
     
     
         8 . The stacked package as claimed in  claim 4 , wherein the second upper circuit layer comprises a second upper redistribution layer and the second lower circuit layer comprises a second lower redistribution layer. 
     
     
         9 . A package, comprising:
 a first molding compound, having a first surface, a second surface and a plurality of first accommodating grooves, wherein the first accommodating grooves penetrate the first molding compound;   a plurality of first dice, disposed in the first accommodating grooves, each of the first dice having a first surface, a second surface and at least one first via, wherein the first surfaces of the first dice are exposed to the first surface of the first molding compound, the second surfaces of the first dice are exposed to the second surface of the first molding compound;   a first upper circuit layer, disposed on the second surface of the first molding compound; and   a first lower circuit layer, disposed on the first surface of the first molding compound, and the first upper circuit layer electrically connected to the first lower circuit layer by the first via.   
     
     
         10 . The package as claimed in  claim 9 , further comprising a plurality of first ball pads disposed on the first surfaces of the first dice. 
     
     
         11 . The package as claimed in  claim 9 , further comprising a plurality of first solder balls disposed on the first lower circuit layer. 
     
     
         12 . The stacked package as claimed in  claim 9 , wherein the first upper circuit layer comprises a first upper redistribution layer and the first lower circuit layer comprises a first lower redistribution layer. 
     
     
         13 . A package, comprising:
 a molding compound, having a first surface, a second surface and a accommodating groove, wherein the accommodating groove penetrates the molding compound;   a die, disposed in the accommodating groove, having a first surface, a second surface and at least one via, wherein the first surface of the die is exposed to the first surface of the molding compound, and the second surface of the die is exposed to the second surface of the molding compound;   an upper circuit layer, disposed on the second surface of the molding compound; and   a lower circuit layer, disposed on the first surface of the molding compound, and the upper circuit layer electrically connected to the lower circuit layer by the via.   
     
     
         14 . The package as claimed in  claim 13 , further comprising a plurality of ball pads disposed on the first surface of the die. 
     
     
         15 . The package as claimed in  claim 13 , further comprising a plurality of solder balls disposed on the lower circuit layer. 
     
     
         16 . The package as claimed in  claim 13 , wherein the upper circuit layer comprises an upper redistribution layer and the lower circuit layer comprises a lower redistribution layer.