Electronic device housing and method for manufacturing the same

Abstract

A housing is provided, with a plurality of tridimensional patterns formed on opposite surfaces of the housing. The patterns are formed by stamping process.

1 . A housing comprising:
 an outer surface; and   an inner surface;   wherein a plurality of tridimensional patterns is formed on the outer surface and the inner surface by a stamping process, the patterns of the inner surface is opposite to the patterns of the outer surface.   
     
     
         2 . The housing of  claim 1 , wherein the housing is made of copper, iron, aluminum, titanium, singly or in combination. 
     
     
         3 . The housing of  claim 1 , wherein the housing is made of aluminum alloy. 
     
     
         4 . The housing of  claim 1 , wherein the housing is anodized. 
     
     
         5 . The housing of  claim 1 , wherein the patterns on the inner surface is intaglio and the patterns on the outer surface is relief. 
     
     
         6 . The housing of  claim 1 , wherein the patterns on the inner surface is relief and the patterns on the outer surface is intaglio. 
     
     
         7 . The housing of  claim 1 , wherein a height or depth of the patterns is about 0.03 millimeters. 
     
     
         8 . The housing of  claim 1 , wherein the thickness of the housing is about 0.8 millimeters. 
     
     
         9 . The housing of  claim 1 , wherein a flange extends towards the inner surface from edges of the housing by stamping the housing. 
     
     
         10 . The housing of  claim 10 , wherein an arc-shaped corner is formed between every two adjacent sides of the flange. 
     
     
         11 . The housing of  claim 11 , wherein a cutout is defined in a middle of a side of the housing. 
     
     
         12 . The housing of  claim 1 , wherein in length of the patterns per square meter is 650 meters. 
     
     
         13 . A method for manufacturing a housing, the method comprising:
 providing sheet metal; and   embossing the sheet metal by stamping process to form a plurality of tridimensional patterns on two opposite surfaces of the sheet metal, the patterns of the two opposite surfaces are opposite to each other.   
     
     
         14 . The method of  claim 13 , further comprising the step of anodizing the housing after forming the patterns. 
     
     
         15 . The method of  claim 13 , wherein the blanking clearance of the stamping die is zero blanking clearance. 
     
     
         16 . The method of  claim 13 , wherein the blanking clearance of the stamping die ranges from 0 to 10% of T, where T is a thickness of the sheet metal. 
     
     
         17 . The method of  claim 13 , wherein a thickness of the sheet metal ranges from 0.2 millimeters (mm) to 1.5 mm.