Polishing apparatus

Abstract

A polishing apparatus according to the present invention includes a polishing tape ( 41 ) having a polishing surface, a substrate holder configured to hold and rotate a substrate (W), a press pad ( 50 ) configured to press the polishing tape against a bevel portion of the substrate held by the substrate holder, and a polishing-tape feeding mechanism ( 45 ) configured to cause the polishing tape to travel in its longitudinal direction. The press pad ( 50 ) includes a pad body ( 53 ), a plate-shaped pressing section having a pressing surface ( 51 a ) for pressing the bevel portion of the substrate through the polishing tape and having a rear surface ( 51 b ) opposite to the pressing surface, and a plurality of coupling sections ( 52 ) coupling the pressing section to the pad body. A space (S) is formed between the rear surface of the pressing section and the pad body.

1 . A polishing apparatus comprising:
 a polishing tape having a polishing surface;   a substrate holder configured to hold and rotate a substrate;   a press pad configured to press the polishing tape against a bevel portion of the substrate held by said substrate holder; and   a polishing-tape feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction,   wherein said press pad includes
 a pad body, 
 a plate-shaped pressing section having a pressing surface for pressing the bevel portion of the substrate through the polishing tape and having a rear surface opposite to said pressing surface, and 
 a plurality of coupling sections coupling said pressing section to said pad body, and 
   wherein a space is formed between said rear surface of said pressing section and said pad body.   
     
     
         2 . The polishing apparatus according to  claim 1 , wherein said plurality of coupling sections are arranged along a circumferential direction of the substrate held by said substrate holder. 
     
     
         3 . The polishing apparatus according to  claim 1 , wherein said plurality of coupling sections are connected to both sides of said pressing section. 
     
     
         4 . The polishing apparatus according to  claim 1 , wherein said plurality of coupling sections are connected to said rear surface of said pressing section and located inwardly from both sides of said pressing section toward a center of said pressing section. 
     
     
         5 . The polishing apparatus according to  claim 1 , wherein said rear surface of said pressing section has a plurality of grooves extending in a direction perpendicular to a surface of the substrate. 
     
     
         6 . The polishing apparatus according to  claim 1 , wherein a plurality of reinforcing members, extending in a direction perpendicular to a surface of the substrate, are secured to said rear surface of said pressing section. 
     
     
         7 . The polishing apparatus according to  claim 1 , wherein said rear surface of said pressing section has at least one recess extending in a circumferential direction of the substrate. 
     
     
         8 . The polishing apparatus according to  claim 1 , wherein said pressing section has a shape such that a thickness thereof increases gradually from both sides of said pressing section toward a center thereof. 
     
     
         9 . The polishing apparatus according to  claim 1 , wherein said pressing section is made from rigid plastic.