Electronic component-embedded printed circuit board and method of manufacturing the same

Abstract

Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate; an insulating material layer which is formed on the other side of the base plate to bury the electronic component; and a first circuit layer which is formed on one side of the base plate and includes connection patterns coming into contact with connecting terminals of the electronic component, and a method of manufacturing the same. The electronic component-embedded printed circuit board is advantageous in that the active surface of an electronic component is disposed such that it is flush with one side of a base plate, so that additional viaholes do not need to be formed, with the result that a laser process requiring high cost can be omitted, thereby simplifying the manufacturing process of a printed circuit board and reducing the manufacturing cost thereof.

1 . An electronic component-embedded printed circuit board, comprising:
 a base plate having a cavity formed therein in a thickness direction thereof;   an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate;   an insulating material layer which is formed on the other side of the base plate to bury the electronic component; and   a first circuit layer which is formed on one side of the base plate and includes connection patterns coming into contact with connecting terminals of the electronic component.   
     
     
         2 . The electronic component-embedded printed circuit board according to  claim 1 , further comprising a second circuit layer formed on an outer side of the insulating material layer. 
     
     
         3 . The electronic component-embedded printed circuit board according to  claim 2 , further comprising vias penetrating the base plate and the insulating material layer and connecting the first circuit layer with the second circuit layer. 
     
     
         4 . The electronic component-embedded printed circuit board according to  claim 1 , further comprising a buildup layer formed on one side of the base plate or an outer side of the insulating material layer. 
     
     
         5 . The electronic component-embedded printed circuit board according to  claim 1 , wherein the base plate is formed of an unclad CCL or an epoxy resin. 
     
     
         6 . The electronic component-embedded printed circuit board according to  claim 1 , wherein the base plate includes patterned copper foil formed on one side thereof such that the patterned copper foil corresponds to the first circuit layer. 
     
     
         7 . The electronic component-embedded printed circuit board according to  claim 1 , wherein the insulation material layer is formed of resin coated copper foil (RCC) or prepreg. 
     
     
         8 . The electronic component-embedded printed circuit board according to  claim 1 , wherein the active surface of the electronic component is an exposed surface of the connecting terminals of the electronic component. 
     
     
         9 . The electronic component-embedded printed circuit board according to  claim 1 , wherein the active surface of the electronic component is an exposed surface of a passivation layer, and the connecting terminals of the electronic component are buried in the passivation layer. 
     
     
         10 . A method of manufacturing an electronic component-embedded printed circuit board, comprising:
 providing a base plate which has a cavity formed in a thickness direction thereof and to one side of which tape is adhered;   disposing an electronic component in the cavity such that an active surface of the electronic component is flush with one side of the base plate;   forming an insulating material layer on the other side of the base plate to bury the electronic component; and   removing the tape from the one side of the base plate and then forming a first circuit layer including connection patterns coming into contact with connecting terminals of the electronic component on the one side of the base plate.   
     
     
         11 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , wherein, in the forming of the first circuit layer, a second circuit layer is formed on an outer side of the insulating material layer. 
     
     
         12 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 11 , wherein vias penetrating the base plate and the insulating material layer are formed such that the first circuit layer is connected with the second circuit layer. 
     
     
         13 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , further comprising: forming a buildup layer on one side of the base plate or an outer side of the insulating material layer after the forming of the first circuit layer. 
     
     
         14 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , wherein, in the disposing of the electronic component, the active surface of the electronic component is an exposed surface of the connecting terminals of the electronic component. 
     
     
         15 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , wherein, in the disposing of the electronic component, the active surface of the electronic component is an exposed surface of a passivation layer, and the connecting terminals of the electronic component are buried in the passivation layer. 
     
     
         16 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , wherein, in the providing of the base plate, the tape is polyimide (PI) tape, thermofoaming tape or UV tape. 
     
     
         17 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , wherein, in the providing of the base plate, the tape is provided with a supporting plate on one side thereof. 
     
     
         18 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , wherein, in the providing of the base plate, the base plate is formed of an unclad CCL or an epoxy resin. 
     
     
         19 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 ,
 wherein, in the providing of the base plate, the base plate is an insulating plate coated with copper foil on one side thereof, and   wherein, in the forming of the first circuit layer, the first circuit layer is formed by forming a plating layer on the copper foil of the base plate and then patterning the plating layer together with the copper foil of the base plate.   
     
     
         20 . The method of manufacturing an electronic component-embedded printed circuit board according to  claim 10 , wherein, in the forming of the insulating material layer, the insulation material layer is formed of resin coated copper foil (RCC) or prepreg.