Inventor · disambiguated record
Hong Won Kim
Also filed as: KIM HONG-WON
13 granted patents·21 pending applications·64 citations·filing 2007–2025
88Inventor score
Files withSAMSUNG ELECTRO MECH18KIM HONG WON6SAMSUNG ELECTRONICS CO LTD6IUCF HYU ERICA CAMPUS1KANG JOON SEOK1
Top patents by PatentIndex Score
34 records- 0193US8893380B2Method of manufacturing a chip embedded printed circuit boardKIM HONG WON·Filed 2009·Granted Nov 25, 2014·37 cites·9 claims
- 0287US10340153B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 2, 2019·6 cites·15 claims
- 0379US7886414B2Method of manufacturing capacitor-embedded PCBSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·7 cites·5 claims
- 0477US8302270B2Method of manufacturing capacitor-embedded PCBKIM WOON-CHUN·Filed 2011·Granted Nov 6, 2012·3 cites·5 claims
- 0569US8351215B2Method of manufacturing a chip embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 8, 2013·4 cites·8 claims
- 0668US8626490B2Dialogue system using extended domain and natural language recognition method and computer-readable medium thereofKIM HONG WON·Filed 2011·Granted Jan 7, 2014·2 cites·20 claims
- 0767US8334602B2Die package including encapsulated die and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Dec 18, 2012·3 cites·3 claims
- 0865US2025271422A1Method for manufacturing multiple silver nanogap shell nanoprobe, multiple silver nanogap shell nanoprobe manufactured thereby, and method for diagnosing liquid biopsy based on sers nanoprobe using sameIUCF HYU ERICA CAMPUS·Filed 2025·Application pending·0 cites
- 0960US9751216B2RobotKIM HONG WON·Filed 2014·Granted Sep 5, 2017·2 cites·8 claims
- 1058US9237654B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 12, 2016·0 cites·6 claims
- 1156US2007201214A1Core board comprising nickel layer, multilayer board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1256US2010139029A1Wheel assembly and robot cleaner having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1354US2009046409A1Capacitor-embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1453US2010175496A1RobotSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1553US2015049445A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1651US9495958B2Dialogue system using extended domain and natural language recognition method and computer-readable medium thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 15, 2016·0 cites·19 claims
- 1751US2014298648A1Electronic component-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1850US8943685B2Method of manufacturing a capacitor-embedded printed circuit boardKWEON YOUNG DO·Filed 2010·Granted Feb 3, 2015·0 cites·6 claims
- 1950US2015085455A1Electronic component-embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2049US10139249B2Metrology system and stage control device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 27, 2018·0 cites·20 claims
- 2149US2008110669A1Printed circuit board having embedded resistors and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2249US2010291488A1Manufacturing method for multilayer core boardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2348US2013056141A1Die package including encapsulated die and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2447US2016212856A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2545US2011097856A1Method of manufacturing wafer level packageKIM HONG WON·Filed 2009·Application pending·0 cites
- 2645US2009045441A1CMOS image sensor packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2743US2011127076A1Electronic component-embedded printed circuit board and method of manufacturing the sameKIM HONG WON·Filed 2010·Application pending·0 cites
- 2842US8554367B2RobotKIM HONG WON·Filed 2010·Granted Oct 8, 2013·0 cites·18 claims
- 2940US2011162477A1RobotSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 3040US2010185328A1Robot and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3139US2016254086A1Coil componentSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3238US2016276090A1Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3338US2016196906A1Coil-embedded substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3438US2016196913A1Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →