Die package including encapsulated die and method of manufacturing the same

Abstract

Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized

1 . A method of manufacturing a die package including an encapsulated die, comprising:
 adhering dies provided on one side thereof with pads onto a tape in a face-down state;   forming an encapsulation layer to cover lateral sides of the dies;   forming a support layer to cover the encapsulation layer and the other side of the dies;   removing the tape and then forming a passivation layer for exposing the pads therethrough; and   forming a redistribution layer on the passivation layer such that one part thereof is connected with the pad.   
     
     
         2 . The method according to  claim 1 , wherein, in the forming of the encapsulation layer, the encapsulation layer is formed through a printing process or a dispensing process. 
     
     
         3 . The method according to  claim 1 , wherein, in the forming of the support layer, the support layer has a thermal expansion coefficient lower than that of the encapsulation layer. 
     
     
         4 . The method according to  claim 1 , wherein, in the forming of the support layer, the support layer is made of a prepreg or a liquid crystalline polymer. 
     
     
         5 . The method according to  claim 1 , wherein, in the forming of the encapsulation layer, the encapsulation layer is formed such that its thickness is less than that of the die. 
     
     
         6 . The method according to  claim 5 , wherein the encapsulation layer is formed such that its thickness is 10˜90% of that of the die. 
     
     
         7 . The method according to  claim 1 , further comprising, after the forming of the redistribution layer:
 forming a solder resist layer having an opening for exposing the other part of the redistribution layer on the passivation layer and the redistribution layer;   forming an external connecting terminal on the other part of the redistribution layer exposed by the opening; and   cutting the resulting structure into respective package units along a scribing line by performing a singulation process.