Inventor · disambiguated record
Joon Seok Kang
Also filed as: KANG JOON SEOK
20 granted patents·24 pending applications·246 citations·filing 2002–2017
94Inventor score
Files withSAMSUNG ELECTRO MECH25KANG JOON SEOK7SAMSUNG ELECTRONICS CO LTD7KIM HONG WON2KIM WOON CHUN1
Top patents by PatentIndex Score
44 records- 0196USD626588SCopy machine attached by function of scanner and printerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 2, 2010·81 cites·1 claims
- 0293US8893380B2Method of manufacturing a chip embedded printed circuit boardKIM HONG WON·Filed 2009·Granted Nov 25, 2014·37 cites·9 claims
- 0389USD584347SLaser printerSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 6, 2009·41 cites·1 claims
- 0482USD629023SHandle for refrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Dec 14, 2010·26 cites·1 claims
- 0577US7632709B2Method of manufacturing wafer level packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Dec 15, 2009·7 cites·6 claims
- 0673US8026590B2Die package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Sep 27, 2011·5 cites·16 claims
- 0773US7727877B2Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillarSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 1, 2010·6 cites·5 claims
- 0871US10172187B2Induction heating cookerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 1, 2019·1 cites·19 claims
- 0971US8283768B2Wafer Level package for heat dissipation and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Oct 9, 2012·4 cites·6 claims
- 1070US8110914B2Wafer level package with removable chip protecting layerKANG JOON SEOK·Filed 2009·Granted Feb 7, 2012·4 cites·4 claims
- 1169US8351215B2Method of manufacturing a chip embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 8, 2013·4 cites·8 claims
- 1267US8334602B2Die package including encapsulated die and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Dec 18, 2012·3 cites·3 claims
- 1364US9591698B2Induction heating cookerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·19 claims
- 1464US7113689B2Microelectromechanical systems (MEMS) variable optical attenuatorSAMSUNG ELECTRO MECH·Filed 2003·Granted Sep 26, 2006·9 cites·18 claims
- 1562US6552839B1Optical switchSAMSUNG ELECTRO MECH·Filed 2002·Granted Apr 22, 2003·8 cites·5 claims
- 1652US2014174794A1Heat radiating substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1751US6833288B2Dicing method for micro electro mechnical system chipSAMSUNG ELECTRO MECH·Filed 2003·Granted Dec 21, 2004·4 cites·3 claims
- 1851US2014353004A1Insulation resin composition for printed circuit board having improved thermal conductivity and electrical properties, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1950US2009321118A1Printed circuit board embedded chip and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2050US2014187112A1Prepreg, method for manufacturing the same, and copper clad laminate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2149US2013005089A1Wafer Level Package For Heat Dissipation And Method Of Manufacturing The SameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2248US2014187674A1Resin composition with enhanced heat-releasing properties, heat-releasing film, insulating film, and prepregSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2348US2013056141A1Die package including encapsulated die and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2448US2014313676A1Electronic component packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2547US8779580B2Electronic component package and manufacturing method thereofKANG JOON-SEOK·Filed 2008·Granted Jul 15, 2014·0 cites·5 claims
- 2647US2014034358A1Electrode pattern and method of manufacturing the same, printed circuit board using electrode pattern and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2747US2012295404A1Method of manufacturing semiconductor packageKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 2847US2014041906A1Metal heat radiation substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2946US2010059881A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3046US2012042513A1Manufacturing method of printed circuit board embedded chipKIM WOON CHUN·Filed 2011·Application pending·0 cites
- 3146US2012129297A1Method of manufacturing wafer level packageKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 3246US2014054072A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3345US2011108993A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3445US2009166859A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3545US2011097856A1Method of manufacturing wafer level packageKIM HONG WON·Filed 2009·Application pending·0 cites
- 3645US2009302468A1Printed circuit board comprising semiconductor chip and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3743USD572716SFacsimileSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 8, 2008·4 cites·1 claims
- 3841US2008211083A1Electronic package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3939US2014174792A1Insulating film for printed circuit board having improved thermal conductivity, manufacturing method thereof, and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4038US2013319734A1Package substrate and method of manufacturing the sameSHIN SANG HYUN·Filed 2012·Application pending·0 cites
- 4137US2004005735A1Dicing method for micro electro mechanical system chipSAMSUNG ELECTRO MECH·Filed 2003·Application pending·0 cites
- 4236US2013139753A1Apparatus for manufacturing substrateKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 4333US9209101B2Semiconductor package with a conductive shielding memberYOO DO-JAE·Filed 2010·Granted Dec 8, 2015·0 cites·6 claims
- 4432USD544869SFacsimile machineSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 19, 2007·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →