Electronic Assemblies without Solder and Methods for their Manufacture

Abstract

The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

1 - 15 . (canceled) 
     
     
         16 . A method of making a circuit assembly comprising:
 placing  800  at least one component  406  on a substrate  808 , the component  406  having at least two sides, the substrate  808  having a first planar side and a second planar side, incorporating  900  a first electrically insulating material  908 , the insulating material  908  attaching at least one side of the at least one component  406  with the first planar side of the substrate  808 , and forming  1000  a first set of at least one via  1002  through the second planar side of substrate  808  to expose a first set of at least one lead  412  of the at least one component  406 .   
     
     
         17 . A method of making a circuit assembly comprising:
 placing  800  at least one component package  802 ,  804 ,  806  on a substrate  808 , the component package  802 ,  804 ,  806  having at least two sides, the substrate  808  having a first planar side and a second planar side, incorporating  900  a first electrically insulating material  908 , the insulating material  908  attaching at least one side of the at least one component package  802 ,  804 ,  806  with the first planar side of the substrate  808 , and forming  1000  a first set of at least one via  1002  through the second planar side of substrate  808  to expose a first set of at least one lead  1406  of the at least one component package  802 ,  804 ,  806 .   
     
     
         18 . The method of  claim 17  further comprising filling  1200  the first set of at least one via  1002  with a first electrically conductive material. 
     
     
         19 . The method of  claim 18  wherein the first electrically conductive material forms a second set of at least one lead  1208 ,  1506 . 
     
     
         20 . The method of  claim 19  further comprising:
 forming  1500  a first layer  1502  of a second electrically insulating material  1502  on the substrate  808  wherein the second insulating material  1502  covers the first electrically conductive material. 
 
     
     
         21 . The method of  claim 20  further comprising:
 forming  1500  a second set of at least one via  1504  extending through the layer  1502  exposing a second set of at least one lead  1208 ,  1506 . 
 
     
     
         22 . The method of  claim 21  further comprising:
 filling  1602  the second set of at least one via  1504  with a second electrically conductive material. 
 
     
     
         23 . A product manufactured by the process of  claim 17 .