Thermoelectric Heating/Cooling Structures Including a Plurality of Spaced Apart Thermoelectric Components

Abstract

A thermoelectric heating/cooling structure may include a heat exchanger and a heat spreader spaced apart from the heat exchanger. In addition, a plurality of spaced apart thermoelectric components may be thermally coupled in parallel between the heat exchanger and the heat spreader. More particularly, each of the thermoelectric components may include a first header adjacent the heat exchanger, a second header adjacent the heat spreader, and a plurality of thermoelectric elements thermally coupled in parallel between the first and second headers. The first headers of the thermoelectric components may be spaced apart adjacent the heat exchanger, and the second headers of the thermoelectric components may be spaced apart adjacent the heat spreader.

1 . A thermoelectric heating/cooling structure comprising:
 a heat exchanger;   a heat spreader spaced apart from the heat exchanger;   a plurality of spaced apart thermoelectric components thermally coupled in parallel between the heat exchanger and the heat spreader, wherein each of the thermoelectric components includes a first header adjacent the heat exchanger, a second header adjacent the heat spreader, and a plurality of thermoelectric elements thermally coupled in parallel between the first and second headers, wherein the first headers of the thermoelectric components are spaced apart adjacent the heat exchanger, and wherein the second headers of the thermoelectric components are spaced apart adjacent the heat spreader.   
     
     
         2 . The thermoelectric heating/cooling structure according to  claim 1  further comprising:
 a low melting temperature metal and/or alloy thermally coupled between the heat exchanger and each of the first headers of the respective thermoelectric components and/or between the heat spreader and each of the second headers of the respective thermoelectric components. 
 
     
     
         3 . The thermoelectric heating/cooling structure according to  claim 2  wherein each of the thermoelectric elements is bonded between the first and second headers of the respective thermoelectric component using a solder, wherein the low melting temperature metal and/or alloy has a melting temperature that is less than a melting temperature of the solder used to bond the thermoelectric components. 
     
     
         4 . The thermoelectric heating/cooling structure according to  claim 2  wherein the low melting temperature metal and/or alloy comprises gallium-tin. 
     
     
         5 . The thermoelectric heating/cooling structure according to  claim 2  wherein the low melting temperature metal and/or alloy has a melting temperature that is lower than an operating temperature of a surface of the heat exchanger adjacent the thermoelectric components, wherein the low melting temperature metal and/or alloy is thermally coupled between the heat exchanger and the first headers, and wherein the second headers remain solidly bonded to the heat spreader over operating temperatures of the surface of the heat spreader. 
     
     
         6 . The thermoelectric heating/cooling structure according to  claim 1  further comprising:
 a mechanical stand-off structure between the heat exchanger and the heat spreader wherein the mechanical stand-off structure is configured to maintain a gap between the heat exchanger and the heat spreader. 
 
     
     
         7 . The thermoelectric heating/cooling structure according to  claim 1  further comprising:
 a fluid seal between the heat exchanger and the heat spreader wherein the fluid seal surrounds the plurality of thermoelectric components. 
 
     
     
         8 . The thermoelectric heating/cooling structure according to  claim 1  wherein the heat exchanger includes a fluid inlet and a fluid outlet configured to allow heat exchange between a heat exchange fluid and the heat exchanger. 
     
     
         9 . The thermoelectric heating/cooling structure according to  claim 1  wherein the heat spreader includes a surface spaced apart from the plurality of thermoelectric components, wherein the surface is configured to thermally engage with a device under test. 
     
     
         10 . The thermoelectric heating/cooling structure according to  claim 9  wherein the plurality of thermoelectric components are configured to pump heat between device under test and the heat exchanger through the heat spreader. 
     
     
         11 . The thermoelectric heating/cooling structure according to  claim 9  further comprising:
 a servomechanism mechanically coupled to the heat exchanger and heat spreader, wherein the servomechanism is configured to position the surface of the heat spreader on the device under test during test operations and to remove the surface of the heat spreader from the device under test. 
 
     
     
         12 . The thermoelectric heating/cooling structure according to  claim 11  wherein the device under test is electrically and mechanically coupled to a printed wiring board, the thermoelectric heating/cooling structure further comprising:
 a mounting frame configured to engage portions of the printed wiring board spaced apart from the device under test when the surface of the heat spreader is positioned on the device under test. 
 
     
     
         13 . The thermoelectric heating/cooling structure according to  claim 12  wherein the mounting frame defines an opening surrounding the heat spreader so that the mounting frame is spaced apart from the heat spreader. 
     
     
         14 . The thermoelectric heating/cooling structure according to  claim 13  further comprising:
 a resilient mechanical coupling between the mounting frame and the heat spreader, wherein the resilient mechanical coupling is configured to allow movement of the heat spreader relative to the mounting frame. 
 
     
     
         15 . The thermoelectric heating/cooling structure according to  claim 14  wherein the resilient mechanical coupling comprises at least one spring. 
     
     
         16 . The thermoelectric heating/cooling structure according to  claim 12  wherein the mounting frame is mechanically fixed to the heat spreader and wherein the mounting frame includes an opening therethrough to allow thermal contact between the device under test and the heat spreader. 
     
     
         17 . The thermoelectric heating/cooling structure according to  claim 16  wherein the mounting frame, the heat spreader, and the heat exchanger define a sealed enclosure. 
     
     
         18 . The thermoelectric heating/cooling structure according to  claim 16  wherein the mounting frame comprises a plastic frame.