Inventor · disambiguated record
Philip A. Deane
Also filed as: DEANE PHILIP · DEANE PHILIP A
15 granted patents·3 pending applications·605 citations·filing 1996–2020
94Inventor score
Files withMCNC6JDS UNIPHASE CORP4DEANE PHILIP A2LAIRD THERMAL SYSTEMS INC2NEXTREME THERMAL SOLUTIONS INC2
Top patents by PatentIndex Score
18 records- 0196US6377438B1Hybrid microelectromechanical system tunable capacitor and associated fabrication methodsMCNC·Filed 2000·Granted Apr 23, 2002·151 cites·38 claims
- 0292US7160039B2Compact optical sub-assembly with integrated flexible circuitJDS UNIPHASE CORP·Filed 2005·Granted Jan 9, 2007·45 cites·17 claims
- 0391US7855397B2Electronic assemblies providing active side heat pumpingNEXTREME THERMAL SOLUTIONS INC·Filed 2008·Granted Dec 21, 2010·33 cites·11 claims
- 0491US6233088B1Methods for modulating a radiation signalMCNC·Filed 2000·Granted May 15, 2001·43 cites·26 claims
- 0590US5963793AMicroelectronic packaging using arched solder columnsMCNC·Filed 1998·Granted Oct 5, 1999·98 cites·21 claims
- 0687US6792171B2Receiver optical sub-assemblyJDS UNIPHASE CORP·Filed 2003·Granted Sep 14, 2004·48 cites·21 claims
- 0787US6137623AModulatable reflectors and methods for using sameMCNC·Filed 1998·Granted Oct 24, 2000·71 cites·30 claims
- 0886US7476040B2Compact optical sub-assembly with ceramic packageJDS UNIPHASE CORP·Filed 2005·Granted Jan 13, 2009·21 cites·18 claims
- 0984US5793116AMicroelectronic packaging using arched solder columnsMCNC·Filed 1996·Granted Aug 11, 1998·66 cites·19 claims
- 1073US7042306B2Three dimensional multimode and optical coupling devicesRES TRIANGLE INST·Filed 2004·Granted May 9, 2006·9 cites·62 claims
- 1170US6906598B2Three dimensional multimode and optical coupling devicesMCNC·Filed 2002·Granted Jun 14, 2005·8 cites·46 claims
- 1268US9190592B2Thin film thermoelectric devices having favorable crystal tiltNEXTREME THERMAL SOLUTIONS INC·Filed 2013·Granted Nov 17, 2015·2 cites·27 claims
- 1367US8525016B2Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systemsDEANE PHILIP A·Filed 2010·Granted Sep 3, 2013·3 cites·24 claims
- 1459US7007835B2Solder bonding technique for assembling a tilted chip or substrateJDS UNIPHASE INC·Filed 2004·Granted Mar 7, 2006·7 cites·17 claims
- 1555US10634396B2Thermoelectric heating/cooling devices including resistive heatersLAIRD THERMAL SYSTEMS INC·Filed 2014·Granted Apr 28, 2020·0 cites·21 claims
- 1652US2020224935A1Thermoelectric heating/cooling devices including resistive heatersLAIRD THERMAL SYSTEMS INC·Filed 2020·Application pending·0 cites
- 1738US2002170943A1Solder bonding technique for assembling a tilted detector chipJDS UNIPHASE CORP·Filed 2002·Application pending·0 cites
- 1834US2011132000A1Thermoelectric Heating/Cooling Structures Including a Plurality of Spaced Apart Thermoelectric ComponentsDEANE PHILIP A·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →