Thermoelectric heating/cooling devices including resistive heaters

Abstract

A thermoelectric heating/cooling device may include first and second thermally conductive headers. A plurality of thermoelectric elements thermally may be coupled in parallel between the first and second thermally conductive headers. In addition, a resistive heating element may be provided on the second header, and the second header may be between the resistive heating element and the plurality of thermoelectric elements.

That which is claimed is: 
     
         1 . A thermoelectric heating/cooling device comprising:
 first and second thermally conductive headers;   a plurality of thermoelectric elements thermally coupled in parallel between the first and second thermally conductive headers; and   a resistive heating element comprising a pattern of electrically conductive material, wherein the second thermally conductive header is between the resistive heating element and the thermoelectric elements.   
     
     
         2 . The thermoelectric heating/cooling device of  claim 1 , wherein the pattern of electrically conductive material comprises dimensions that are configured to generate resistive heat responsive to passing an electrical current therethrough. 
     
     
         3 . The thermoelectric heating/cooling device of  claim 2 , wherein the pattern of electrically conductive material comprises a metal pattern. 
     
     
         4 . The thermoelectric heating/cooling device of  claim 3 , wherein the metal pattern comprises a serpentine pattern. 
     
     
         5 . The thermoelectric heating/cooling device of  claim 2 , wherein the second thermally conductive header and the resistive heating element are configured to be thermally coupled to a load. 
     
     
         6 . The thermoelectric heating/cooling device of  claim 5 , wherein the resistive heating element is on the second thermally conductive header opposite the thermoelectric elements. 
     
     
         7 . The thermoelectric heating/cooling device of  claim 6 , wherein the dimensions of the pattern are configured to reduce effects thereof on thermal conduction of the second thermally conductive header. 
     
     
         8 . The thermoelectric heating/cooling device of  claim 5 , wherein the resistive heating element is separated from the second thermally conductive header. 
     
     
         9 . The thermoelectric heating/cooling device of  claim 5 , wherein the load comprises a polymerase chain reaction (PCR) vessel holder. 
     
     
         10 . The thermoelectric heating/cooling device of  claim 1 , wherein the thermoelectric elements are configured to pump heat from the first thermally conductive header to the second thermally conductive header responsive to a thermoelectric control signal applied thereto in conjunction with application of a resistive heater control signal to the resistive heating element. 
     
     
         11 . The thermoelectric heating/cooling device of  claim 10 , wherein the thermoelectric control signal is a first thermoelectric control signal, and wherein the thermoelectric elements are configured to pump heat from the second thermally conductive header to the first thermally conductive header responsive to a second thermoelectric control signal applied thereto in conjunction with blocking electrical current to the resistive heating element. 
     
     
         12 . A temperature control device, comprising:
 a thermoelectric heating/cooling element configured to provide heating of a thermal load responsive to a thermoelectric control signal applied thereto; and   a resistive heating element configured to provide resistive heating of the thermal load responsive to resistive heater control signal applied thereto.   
     
     
         13 . The temperature control device of  claim 12 , wherein the resistive heating element comprises a pattern of electrically conductive material. 
     
     
         14 . The temperature control device of  claim 13 , wherein the pattern of electrically conductive material comprises a metal pattern having dimensions that are configured to generate resistive heat responsive to passing an electrical current therethrough. 
     
     
         15 . The temperature control device of  claim 12 , wherein the thermoelectric heating/cooling device comprises:
 first and second thermally conductive headers;   a plurality of thermoelectric elements thermally coupled in parallel between the first and second thermally conductive headers,   wherein the second thermally conductive header and the resistive heating element are configured to be thermally coupled to the thermal load.   
     
     
         16 . The temperature control device of  claim 15 , wherein the resistive heating element is on the second thermally conductive header opposite the thermoelectric elements. 
     
     
         17 . The temperature control device of  claim 16 , wherein the resistive heating element is a first resistive heating element, and further comprising:
 a second resistive heating element configured to be thermally coupled to the thermal load.   
     
     
         18 . The temperature control device of  claim 17 , wherein the second thermally conductive header and the second resistive heating element are configured to be coupled to opposite sides of the thermal load. 
     
     
         19 . The temperature control device of  claim 15 , wherein the thermoelectric elements are configured to pump heat from the first thermally conductive header to the second thermally conductive header responsive to the thermoelectric control signal applied thereto in conjunction with application of the resistive heater control signal to the resistive heating element. 
     
     
         20 . The temperature control device of  claim 19 , wherein the thermoelectric control signal is a first thermoelectric control signal, and wherein the thermoelectric elements are configured to pump heat from the second thermally conductive header to the first thermally conductive header responsive to a second thermoelectric control signal applied thereto in conjunction with blocking electrical current to the resistive heating element. 
     
     
         21 . The temperature control device of  claim 12 , wherein the thermal load comprises a reaction vessel holder. 
     
     
         22 . A thermoelectric heating/cooling device comprising:
 first and second thermally conductive headers;   a plurality of thermoelectric elements thermally coupled in parallel between the first and second thermally conductive headers; and   a resistive heating element comprising a pattern of electrically conductive material that is configured to generate resistive heat responsive to passing an electrical current therethrough, wherein the second thermally conductive header is between the resistive heating element and the thermoelectric elements,   wherein the thermoelectric elements are configured to pump heat from the first thermally conductive header to the second thermally conductive header responsive to a thermoelectric control signal applied thereto in conjunction with passing the electrical current through the resistive heating element responsive to a resistive heater control signal applied thereto.