Conductive film structure, fabrication method thereof, and conductive film type probe device for ic

Abstract

A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

1 - 12 . (canceled) 
     
     
         13 . A conductive film structure, comprising:
 an insulating bulk having a first surface and an opposite second surface;   a spiroid or folding interface located in the insulating bulk and extending from the first surface to the second surface; and   a plurality of micro-wires located in the insulating bulk, wherein extending directions of the micro-wires are substantially parallel to a normal vector of the first surface or the second surface, and wherein the micro-wires are disposed substantially along the spiroid or folding interface.   
     
     
         14 . The conductive film structure as claimed in  claim 13 , wherein two opposite ends of each of the micro-wires are exposed from the first surface and the second surface. 
     
     
         15 . The conductive film structure as claimed in  claim 13 , wherein the first surface or the second surface of the insulating bulk is square, rectangular, circular, trapezoidal, or triangular. 
     
     
         16 . The conductive film structure as claimed in  claim 13 , wherein the insulating bulk comprises a polymer comprising polydimethylsiloxane, polyimide, polyethylene terephthalate, derivatives thereof, or combinations thereof. 
     
     
         17 . The conductive film structure as claimed in  claim 13 , wherein the insulating bulk comprises:
 a flexible insulating substrate wound or folded substantially along the extending directions of the micro-wires; and   an insulating layer formed overlying the flexible insulating substrate and the micro-wires.   
     
     
         18 . The conductive film structure as claimed in  claim 13 , wherein the micro-wires comprise nickel, cobalt, gold, copper, aluminum, platinum, indium tin oxide, indium zinc oxide, or combinations thereof. 
     
     
         19 . The conductive film structure as claimed in  claim 13 , wherein each spacing of the micro-wires is substantially the same. 
     
     
         20 . A conductive film type probe device for IC, comprising:
 a circuit board having a plurality of first contacts and a plurality of second contacts, wherein the first contacts are used to electrically connect to a testing apparatus; and   a conductive film structure as claimed in  claim 13 , wherein each of the second contacts electrically connects to at least one of the micro-wires of the conductive film structure.   
     
     
         21 . The conductive film type probe device for IC as claimed in  claim 20 , wherein the second contacts are arranged corresponding to, and in the same manner as contacts of a to-be-tested integrated circuit.