US2011173994A1PendingUtilityA1

Cooling system for semiconductor manufacturing and testing processes

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Assignee: ADVANCED SEMICONDUCTOR ENGPriority: Jan 15, 2010Filed: Aug 25, 2010Published: Jul 21, 2011
Est. expiryJan 15, 2030(~3.5 yrs left)· nominal 20-yr term from priority
H10P 72/0434F25B 9/04
26
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Claims

Abstract

A cooling system for providing a desired environment for a semiconductor manufacturing and/or testing processes includes a vortex unit and a semiconductor processing device suitable for performing a semiconductor processing function. The vortex unit includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a dry air tube enclosing the second air exhaust and connecting to the air compressor unit and the vortex unit. Since the dry air continuously flows surrounding the cold air tube, no water will be condensed around the cold air tube. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested products.

Claims

exact text as granted — not AI-modified
1 . A cooling system for providing a desired environment for a semiconductor manufacturing and testing process, comprising:
 a vortex unit having an air inlet for receiving a compressed air;   a hot air exhaust tube for outputting an air stream having a temperature greater than the received compressed air;   a cold air exhaust tube for outputting an air stream having a temperature lower than the received compressed air;   a dry air tube enclosing the cold air exhaust tube, wherein the dry air inside the dry air tube continuously flows surrounding the cold air tube; and   an air compressor system for supplying compressed air to the vortex tube and the dry air tube.   
     
     
         2 . A cooling system as described in  claim 1 , wherein the vortex unit further comprises a valve constructed on the end of the hot air exhaust tube to control the cold fraction of the hot air in the hot air exhaust tube and the cold air in the cold air exhaust tube. 
     
     
         3 . A vortex cooling system for providing a desired environment for a semiconductor manufacturing and testing process, comprising:
 a vortex unit having an air inlet for receiving a compressed air;   a hot air exhaust tube for outputting an air stream having a temperature greater than the received compressed air;   a cold air exhaust tube for outputting an air stream having a temperature lower than the received compressed air; and   a dry air tube enclosing the cold air exhaust tube, wherein the dry air inside the dry air tube continuously flows surrounding the cold air tube.   
     
     
         4 . A vortex cooling system as described in  claim 1 , wherein the vortex unit further comprises a valve constructed on the end of the hot air exhaust tube to control the cold fraction of the hot air in the hot air exhaust tube and the cold air in the cold air exhaust tube.

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