Method of manufacturing chuck plate for use in electrostatic chuck

Abstract

There is provided a method of manufacturing a chuck plate for an electrostatic chuck of good productivity which is free from poor releasing of a wafer which is a to-be-processed substrate, from the initial time of putting the electrostatic chuck to a new use. The method of manufacturing a chuck plate for electrostatic chuck ES which is made up of a dielectric body to cover a surface of the chuck main body having electrodes, includes the steps of: obtaining a sintered body by compression-forming raw material powder (or raw meal) into a predetermined shape and then sintering the same; forming, by polishing, such a surface of the sintered body as will come into contact with a substrate to be attracted, into a predetermined surface roughness and flatness; and performing blast processing for selectively removing only ready-to-be-separated particles that come into existence on the surface as a result of the polishing.

1 . A method of manufacturing a chuck plate for use in an electrostatic chuck, the electrostatic chuck comprising: a chuck main body having electrodes; and the chuck plate made of a dielectric body which covers a surface of the chuck main body, the method comprising the steps of:
 obtaining a sintered body by compression-forming raw material powder into a predetermined shape and then sintering the same;   forming, by means of polishing, such a surface of the sintered body as will come into contact with a substrate to be attracted, into a predetermined surface roughness and flatness; and   performing blast processing for selectively removing only ready-to-be-separated particles that come into existence on the surface as a result of the above-mentioned polishing.   
     
     
         2 . The method according to  claim 1 , wherein the blast processing is wet blasting.