Heat-conducting module and heat-dissipating device having the same

Abstract

A heat-conducting module for heat conduction of an electronic heat-generating element includes a heat pipe and a vapor chamber. The vapor chamber has an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. With this arrangement, the contact area and heat-conducting efficiency between the vapor chamber and the heat pipe can be increased greatly, thereby obtaining a heat-conducting module with an excellent heat-conducting efficiency. With a heat-dissipating fin assembly and a fan being connected to the heat pipe, a heat-dissipating device having the aforesaid heat-conducting module can be obtained, whereby the heat of the vapor chamber and the heat pipe can be rapidly dissipated to the outside.

1 . A heat-conducting module for heat conduction of an electronic heat-generating element, comprising:
 a heat pipe; and   a vapor chamber having an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping the heat pipe.   
     
     
         2 . The heat-conducting module according to  claim 1 , wherein a heat-conducting paste layer is applied between the heat-conducting section and the heat pipe. 
     
     
         3 . The heat-conducting module according to  claim 2 , wherein the cross section of the heat pipe is formed into a circular shape, the heat-conducting section is bent into a C shape to wrap around the heat pipe. 
     
     
         4 . The heat-conducting module according to  claim 3 , wherein the heat pipe is bent into a U shape to have a heat-absorbing section and two heat-releasing sections bent from both ends of the heat-absorbing section, the heat-conducting section is bent to wrap around any one of the heat-absorbing section and the heat-releasing sections of the heat pipe. 
     
     
         5 . The heat-conducting module according to  claim 3 , wherein the heat pipe is bent into an S shape to have a heat-absorbing section, a heat-releasing section away from the heat-absorbing section, and an adiabatic section extending between the heat-absorbing section and the heat-releasing section, and the heat-conducting section is bent to wrap around any one of the heat-absorbing section, a heat-releasing section and the adiabatic section of the heat pipe. 
     
     
         6 . The heat-conducting module according to  claim 2 , wherein the cross section of the heat pipe is formed into a flat oval shape, the heat-conducting section is bent into a “ ” shape to wrap around the heat pipe. 
     
     
         7 . The heat-conducting module according to  claim 6 , wherein the heat pipe is bent into a U shape to have a heat-absorbing section and two heat-releasing sections bent from both ends of the heat-absorbing section, and the heat-conducting section is bent to wrap around any one of the heat-absorbing section and the heat-releasing sections of the heat pipe. 
     
     
         8 . The heat-conducting module according to  claim 6 , wherein the heat pipe is bent into an S shape to have a heat-absorbing section, a heat-releasing section away from the heat-absorbing section, and an adiabatic section extending between the heat-absorbing section and the heat-releasing section, and the heat-conducting section is bent to wrap around any one of the heat-absorbing section, a heat-releasing section and the adiabatic section of the heat pipe. 
     
     
         9 . A heat-dissipating device having a heat-conducting module for heat dissipation of an electronic heat-generating element, comprising:
 a heat-conducting module, comprising:   a heat pipe having a heat-absorbing section and a heat-releasing section away from the heat-absorbing section; and   a vapor chamber having an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping the heat pipe; and   a heat-dissipating fin assembly connected to the heat-releasing section.   
     
     
         10 . The heat-dissipating device having a heat-conducting module according to  claim 9 , wherein a heat-conducting paste layer is applied between the heat-conducting section and the heat pipe. 
     
     
         11 . The heat-dissipating device having a heat-conducting module according to  claim 10 , further comprising a fan mounted outside the heat-dissipating fin assembly. 
     
     
         12 . The heat-dissipating device having a heat-conducting module according to  claim 11 , wherein the cross section of the heat pipe is formed into a circular shape, the heat-conducting section is bent into a C shape to wrap around the heat pipe. 
     
     
         13 . The heat-dissipating device having a heat-conducting module according to  claim 12 , wherein the heat pipe is bent into a U shape, and the heat-conducting section is bent to wrap around any one of the heat-absorbing section and the heat-releasing section of the heat pipe. 
     
     
         14 . The heat-dissipating device having a heat-conducting module according to  claim 12 , wherein the heat pipe is bent into an S shape to have an adiabatic section extending between the heat-absorbing section and the heat-releasing section, and the heat-conducting section is bent to wrap any one of the heat-absorbing section, the heat-releasing section and the adiabatic section of the heat pipe. 
     
     
         15 . The heat-dissipating device having a heat-conducting module according to  claim 11 , wherein the cross section of the heat pipe is formed into a flat oval shape, the heat-conducting section is bent into a “ ” shape to wrap around the heat pipe. 
     
     
         16 . The heat-dissipating device having a heat-conducting module according to  claim 15 , wherein the heat pipe is bent into a U shape, anf the heat-conducting section is bent to wrap around any one of the heat-absorbing section and the heat-releasing section of the heat pipe. 
     
     
         17 . The heat-dissipating device having a heat-conducting module according to  claim 15 , wherein the heat pipe is bent into an S shape to have an adiabatic section extending between the heat-absorbing section and the heat-releasing section, and the heat-conducting section is bent to wrap any one of the heat-absorbing section, the heat-releasing section and the adiabatic section of the heat pipe.