Semiconductor package and method of manufacturing the semiconductor package

Abstract

A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which has a ground circuit formed thereon, a semiconductor chip, which is mounted on the substrate, a conductive first shield, which is formed on an upper surface of the semiconductor chip and connected with the ground circuit, and a conductive second shield, which covers the substrate and the semiconductor chip and is connected with the first shield. With a semiconductor package in accordance with an embodiment of the present invention, grounding is possible between semiconductor chips because a shield is also formed on an upper surface of the semiconductor chip, and the shielding property can be improved by a double shielding structure.

1 . A semiconductor package comprising:
 a substrate having a ground circuit formed thereon;   a semiconductor chip mounted on the substrate;   a first shield formed on an upper surface of the semiconductor chip and connected with the ground circuit, the first shield being conductive; and   a second shield covering the substrate and the semiconductor chip and connected with the first shield, the second shield being conductive.   
     
     
         2 . The semiconductor package of  claim 1 , further comprising a molding sealing up the semiconductor chip mounted on the substrate,
 wherein the second shield is formed on the molding.   
     
     
         3 . The semiconductor package of  claim 1 , further comprising a conductive post connecting the second shield with the first shield. 
     
     
         4 . The semiconductor package of  claim 1 , wherein the first shield and the ground circuit are connected by way of wire-bonding. 
     
     
         5 . The semiconductor package of  claim 1 , wherein the first shield is integrated in the semiconductor chip. 
     
     
         6 . The semiconductor package of  claim 1 , further comprising an electronic device having a ground electrode connected with the ground circuit,
 wherein the ground electrode is connected with the second shield.   
     
     
         7 . A method of manufacturing a semiconductor package, the method comprising:
 proving a substrate having a ground circuit formed thereon and having a semiconductor chip mounted thereon;   forming a first shield on an upper surface of the semiconductor chip, the first shield being conductive;   connecting the first shield with the ground circuit; and   forming a second shield covering the substrate and the semiconductor chip and connected with the first shield, the second shield being conductive.   
     
     
         8 . The method of  claim 7 , further comprising forming a molding in such a way that the semiconductor chip mounted on the substrate is sealed up. 
     
     
         9 . The method of  claim 8 , further comprising forming a through-hole in the molding, the first shield being exposed through the through-hole,
 wherein the forming of a second shield comprises forming a second shield connected with the first shield by coating a conductive material on the molding.   
     
     
         10 . The method of  claim 7 , further comprising forming a conductive post on the first shield,
 wherein the forming of a second shield comprises forming a second shield connected with the conductive post.   
     
     
         11 . The method of  claim 7 , wherein the connecting of the first shield with the ground circuit comprises connecting the first shield with the ground circuit by way of wire-bonding.