Method of manufacturing mounting substrate

Abstract

A method of manufacturing a mounting substrate, the method including: providing an insulation layer, the insulation layer having a circuit pattern formed in one side thereof; forming at least one bonding pad in the other side of the insulation layer, the bonding pad electrically connected with the circuit pattern; and etching the bonding pad such that a surface of the bonding pad is recessed from a surface of the insulation layer by a predetermined depth.

1 . A method of manufacturing a mounting substrate, the method comprising:
 providing an insulation layer, the insulation layer having a circuit pattern formed in one side thereof;   forming at least one bonding pad in the other side of the insulation layer, the bonding pad electrically connected with the circuit pattern; and   etching the bonding pad such that a surface of the bonding pad is recessed from a surface of the insulation layer by a predetermined depth.   
     
     
         2 . The method of  claim 1 , wherein the forming of the bonding pad comprises:
 burying at least one land in the other surface of the insulation layer.   
     
     
         3 . The method of  claim 2 , wherein the forming of the bonding pad further comprises:
 forming at least one via in correspondence with a buried position of the land, the via electrically connected with the circuit pattern.   
     
     
         4 . The method of  claim 3 , wherein the etching of the bonding pad comprises:
 etching the via such that a surface of the via is recessed from a surface of the insulation layer by a predetermined depth.   
     
     
         5 . The method of  claim 4 , wherein the etching of the bonding pad comprises:
 etching the land such that a surface of the land is recessed from a surface of the insulation layer by a predetermined depth.