US2012003798A1PendingUtilityA1
Replacement gates to enhance transistor strain
Est. expiryDec 16, 2025(expired)· nominal 20-yr term from priority
Inventors:Mark Bohr
H10D 64/01318H10D 64/013H10D 84/0167H10D 62/822H10D 84/907H10D 84/856H10D 84/0184H10D 84/0181H10D 84/0177H10D 84/0172H10D 84/0165H10D 84/85H10D 64/691H10D 64/683H10D 64/667H10D 64/666H10D 64/514H10D 64/259H10D 64/62H10D 64/017H10D 62/83H10D 30/797H10D 30/792H10D 30/0225H10D 30/60H10D 84/038H10D 84/017
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Claims
Abstract
Some embodiments of the present invention include apparatuses and methods relating to NMOS and PMOS transistor strain.
Claims
exact text as granted — not AI-modified1 . A method comprising:
forming an NMOS transistor including a channel, a stressor, and a gate structure over the channel and between sidewall spacers, wherein the stressor causes a tensile strain on the channel; and removing at least a portion of the gate structure to allow the stressor to enhance the tensile strain on the channel, wherein removing the portion of the gate structure forms a trench.
2 . The method of claim 1 , wherein the stressor comprises a tensile layer over the gate structure.
3 . The method of claim 1 , wherein removing the portion of the gate structure includes removing a gate electrode, and wherein a gate dielectric remains.
4 . The method of claim 3 , wherein the gate dielectric comprises a high-k gate dielectric.
5 . The method of claim 4 , further comprising:
forming a metal gate electrode over the high-k gate dielectric.
6 . A method comprising:
forming a PMOS transistor including a channel, a stressor, and a gate structure over the channel and between sidewall spacers, wherein the stressor causes a compressive strain on the channel; and removing at least a portion of the gate structure to allow the stressor to enhance the compressive strain on the channel, wherein removing the portion of the gate structure forms a trench.
7 . The method of claim 6 , wherein the stressor comprises an epitaxial source and drain film.
8 . The method of claim 6 , wherein removing the portion of the gate structure includes removing a gate electrode and a gate dielectric.
9 . The method of claim 8 , further comprising:
forming a high-k gate dielectric in the trench; and forming a metal gate electrode over the high-k gate dielectric, wherein the metal gate electrode provides an additional compressive strain in the channel.Cited by (0)
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