US2012031563A1PendingUtilityA1

Plasma processing device

35
Assignee: SETSUHARA YUICHIPriority: Mar 11, 2009Filed: Mar 10, 2010Published: Feb 9, 2012
Est. expiryMar 11, 2029(~2.6 yrs left)· nominal 20-yr term from priority
Inventors:Yuichi SetsuharaEiichi NishimuraAkinori Ebe
H01J 37/3211H01J 37/321H05H 1/4652
35
PatentIndex Score
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Claims

Abstract

An inductively coupled plasma processing device using a radio-frequency electric discharge, including: a vacuum container; an antenna-placing section provided between an inner surface and an outer surface of a wall of the vacuum container; a radio-frequency antenna placed in the antenna-placing section, the radio-frequency antenna being terminated without completing one turn; and a dielectric separating member separating the antenna-placing section and an internal space of the vacuum container, wherein the radio-frequency antenna has a length equal to or shorter than one quarter of a wavelength of the radio-frequency waves.

Claims

exact text as granted — not AI-modified
1 . An inductively coupled plasma device using a radio-frequency electric discharge, comprising:
 a) a vacuum container;   b) an antenna-placing section, which is a hollow space formed between an inner surface and an outer surface of a wall of the vacuum container;   c) a radio-frequency antenna placed in the antenna-placing section, the radio-frequency antenna being terminated without completing one turn;   d) a dielectric separating member for separating the antenna-placing section from an internal space of the vacuum container; and   e) a cover provided on the outer-surface side of the hollow space,   wherein the radio-frequency antenna has a length equal to or shorter than one quarter of a wavelength of radio-frequency waves.   
     
     
         2 . (canceled) 
     
     
         3 . The plasma processing device according to  claim 1 , wherein the hollow space is hermetically closed by the cover. 
     
     
         4 . The plasma processing device according to  claim 1 , wherein the hollow space is filled with a solid dielectric material. 
     
     
         5 . The plasma processing device according to  claim 1 , wherein the hollow space is filled with an inert gas. 
     
     
         6 . (canceled) 
     
     
         7 . The plasma processing device according to  claim 1 , wherein the radio-frequency antenna is fixed to the cover. 
     
     
         8 . (canceled) 
     
     
         9 . The plasma processing device according to  claim 1 , wherein the radio-frequency antenna is U-shaped. 
     
     
         10 . The plasma processing device according to  claim 1 , comprising a plurality of the antenna-placing sections.

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