Cooling system for contact cooled electronic modules

Abstract

Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

1 . A flexible cold plate comprising:
 a plurality of tubes adjacently coupled to one another in a substantially planar structure, the plurality of tubes configured to allow a cooling fluid to flow therein;   a first manifold to couple a first set of ends of the plurality of tubes together;   a second manifold to couple a second set of ends of the plurality of tubes together, the first and second manifolds being configured to couple to a circulation source to provide circulation of the cooling fluid within the plurality of tubes;   and a means to bend the flexible cold plate.