US2012038894A1PendingUtilityA1

Lens Cleaning Module

53
Assignee: LIN BURN-JENGPriority: Aug 3, 2004Filed: Oct 27, 2011Published: Feb 16, 2012
Est. expiryAug 3, 2024(expired)· nominal 20-yr term from priority
G03F 7/70341
53
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Claims

Abstract

A lens cleaning module for a lithography system having an exposure apparatus including an objective lens is disclosed. The lens cleaning module includes a scanning stage for supporting a wafer beneath the objective lens. A cleaning module is provided adjacent to the scanning stage for cleaning the objective lens in a non-manual cleaning process.

Claims

exact text as granted — not AI-modified
1 - 20 . (canceled) 
     
     
         21 . A lithography system having an exposure apparatus including an objective lens, the lithography system comprising:
 a lens cleaning module operable to provide a cleaning fluid;   an immersion fluid module operable to provide an immersion fluid, the immersion fluid module being different than the lens cleaning module and the immersion fluid being different than the cleaning fluid;   a scanning stage for supporting a wafer beneath the objective lens; and   a fluid retaining wall carried by the scanning stage and operable to retain the cleaning fluid on the scanning stage, wherein when the lens cleaning module provides the cleaning fluid directly on the scanning stage only the cleaning fluid contacts the objective lens during cleaning of the objective lens.   
     
     
         22 . The lithography system of  claim 21 , wherein the fluid retaining wall is operable to retain the immersion fluid on the scanning stage. 
     
     
         23 . The lithography system of  claim 22 , wherein the fluid retaining wall retains one of the immersion fluid and the cleaning fluid on the scanning stage during exposure of the wafer. 
     
     
         24 . The lithography system of  claim 21 , wherein the cleaning fluid is retained by the fluid retaining wall such that the cleaning fluid contacts the objective lens during exposure of the wafer. 
     
     
         25 . The lithography system of  claim 21 , wherein the scanning stage defines an exposure field, and
 wherein the fluid retaining wall is coupled to the scanning stage around the exposure field.   
     
     
         26 . The lithography system of  claim 21 , wherein the cleaning fluid is one of isopropyl alcohol, acetone, or a solvent. 
     
     
         27 . The lithography system of  claim 21 , further comprising a heating/drying module associated with the lens cleaning module for drying the objective lens. 
     
     
         28 . The lithography system of  claim 21 , wherein the heating/drying module uses one of thermal and gas spray for drying the objective lens. 
     
     
         29 . A method comprising:
 providing an immersion lithography system having a lens cleaning module and an immersion fluid module that is different from the lens cleaning module, the lens cleaning module operable to provide a cleaning fluid and the immersion fluid module operable to provide an immersion fluid;   loading a wafer on a stage of the lithography system;   providing the cleaning fluid directly onto the stage by the lens cleaning module, the cleaning fluid retained by a fluid retaining wall associated with the stage, the fluid retaining wall configured to retain the cleaning fluid such that the cleaning fluid is in contact with an objective lens of the immersion lithography system; and   cleaning a surface of the objective lens utilizing the cleaning fluid provided by the lens cleaning module, wherein only the cleaning fluid contacts the objective lens during the cleaning.   
     
     
         30 . The method of  claim 29 , further comprising providing the immersion fluid directly onto the stage by the immersion fluid module, the immersion fluid retained by the fluid retaining wall associated with the stage. 
     
     
         31 . The method of  claim 29 , wherein the fluid retaining wall is configured to retain the immersion fluid on the stage such that the immersion fluid is in direct contact with the objective lens. 
     
     
         32 . The method of  claim 29 , wherein the fluid retaining wall is configured to allow for the passage of an exposure light through the immersion fluid to an exposure field. 
     
     
         33 . The method of  claim 29 , further comprising exposing the wafer on the stage of the lithography system while cleaning the surface of the objective lens utilizing the cleaning fluid provided by the lens cleaning module. 
     
     
         34 . The method of  claim 29 , wherein cleaning the surface of the objective lens utilizing the cleaning fluid provided by the lens cleaning module occurs while the objective lens is over the wafer. 
     
     
         35 . A lithography system comprising:
 a lens cleaning module having:
 a scanning stage defining an exposure field; 
 a cleaning stage removably coupled to the scanning stage, the cleaning stage having a top surface facing an objective lens of the lithography system; and 
 a cleaning unit coupled to the cleaning stage, the cleaning unit comprising a dispensing nozzle and a cone-shaped collecting annulus extending from the top surface of the cleaning stage toward the objective lens, the cleaning unit configured to clean the objective lens with a first fluid while the objective lens is over the exposure field. 
   
     
     
         36 . The lithography system of  claim 35 , furthering comprising an immersion fluid module operable to provide a second fluid onto the scanning stage, the second fluid being different than the first fluid. 
     
     
         37 . The lithography system of  claim 35 , wherein the dispending nozzle is operable to provide the first liquid against the objective lens such that the first liquid is deflected into the cone-shaped collecting annulus. 
     
     
         38 . The lithography system of  claim 35 , wherein the dispensing nozzle is centrally disposed within the cone-shaped collecting annulus. 
     
     
         39 . The lithography system of  claim 35 , wherein the dispensing nozzle and the cone-shaped collecting annulus are fixedly mounted to the cleaning stage. 
     
     
         40 . The lithography system of  claim 35 , wherein the dispensing nozzle and the cone-shaped collecting annulus are pivotally mounted to the cleaning stage such that the dispensing nozzle and the cone-shaped collecting annulus each pivots relative to the cleaning stage.

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