Inventor · disambiguated record
David Lu
Also filed as: LU DAVID · LU DAVID D · LU DAVID DING-CHUNG
20 granted patents·4 pending applications·193 citations·filing 2003–2015
94Inventor score
Top patents by PatentIndex Score
24 records- 0197US7224427B2Megasonic immersion lithography exposure apparatus and methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 29, 2007·95 cites·31 claims
- 0289US7760144B2Antennas integrated in semiconductor chipsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jul 20, 2010·17 cites·22 claims
- 0386US8105954B2System and method of vapor depositionWANG CHIEN-WEI·Filed 2008·Granted Jan 31, 2012·8 cites·19 claims
- 0486US8022458B2Capacitors integrated with metal gate formationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Sep 20, 2011·12 cites·14 claims
- 0583US7582494B2Device structures for reducing device mismatch due to shallow trench isolation induced oxides stressesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Sep 1, 2009·9 cites·8 claims
- 0682US8237209B2Capacitors integrated with metal gate formationCHANG CHUNG-LONG·Filed 2011·Granted Aug 7, 2012·6 cites·20 claims
- 0782US8053865B2MOM capacitors integrated with air-gapsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 8, 2011·10 cites·15 claims
- 0880US8134235B2Three-dimensional semiconductor deviceCHIOU WEN-CHIH·Filed 2007·Granted Mar 13, 2012·5 cites·18 claims
- 0979US8368220B2Anchored damascene structuresTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 5, 2013·8 cites·18 claims
- 1079US7501227B2System and method for photolithography in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 10, 2009·4 cites·20 claims
- 1179US7259393B2Device structures for reducing device mismatch due to shallow trench isolation induced oxides stressesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 21, 2007·7 cites·10 claims
- 1276US7420188B2Exposure method and apparatus for immersion lithographyTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 2, 2008·4 cites·12 claims
- 1371US8054444B2Lens cleaning module for immersion lithography apparatusTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 8, 2011·2 cites·21 claims
- 1465US7462561B2Contact structure formed using supercritical cleaning fluid and ALCVDLU DAVID·Filed 2005·Granted Dec 9, 2008·2 cites·19 claims
- 1563US8178289B2System and method for photolithography in semiconductor manufacturingCHEN KUEI SHUN·Filed 2009·Granted May 15, 2012·1 cites·8 claims
- 1655US9698080B2Conductor structure for three-dimensional semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
- 1754US9130024B2Three-dimensional semiconductor deviceCHIOU WEN-CHIH·Filed 2012·Granted Sep 8, 2015·0 cites·18 claims
- 1853US2012038894A1Lens Cleaning ModuleLIN BURN-JENG·Filed 2011·Application pending·0 cites
- 1952US7924397B2Anti-corrosion layer on objective lens for liquid immersion lithography applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 12, 2011·3 cites·21 claims
- 2049US2012090547A1System and method of vapor depositionWANG CHIEN-WEI·Filed 2011·Application pending·0 cites
- 2146US8179516B2Protective layer on objective lens for liquid immersion lithography applicationsLIN BURN JENG·Filed 2006·Granted May 15, 2012·0 cites·26 claims
- 2245US8822331B2Anchored damascene structuresLU DAVID·Filed 2011·Granted Sep 2, 2014·0 cites·20 claims
- 2345US2008258303A1Novel structure for reducing low-k dielectric damage and improving copper EM performanceYEH MING-SHIH·Filed 2007·Application pending·0 cites
- 2436US2007080461A1Ultra low-k dielectric in damascene structuresTAIWAN SEMICONDUCTOR MFG COMAP·Filed 2005·Application pending·0 cites
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