Substrate processing apparatus and temperature adjustment method

Abstract

There is provided a substrate processing apparatus including: a chamber in which plasma processing is performed on a substrate; a susceptor which is disposed in the chamber and on which the substrate is held; a shower head which is provided to face the susceptor with a processing space therebetween; a high frequency power source which generates plasma by applying high frequency power to the processing space; water spray devices which form a surface wet with water on a rear surface of a surface of the susceptor as a temperature adjustment surface; an evaporation chamber which isolates the wet surface from an atmosphere around the wet surface; and a pressure adjustment device which adjusts a pressure in the evaporation chamber, wherein the pressure in the evaporation chamber is adjusted by using the pressure adjustment device such that the water which forms the wet surface is evaporated, thereby controlling a temperature of the surface of the susceptor by using latent heat of evaporation of the water.

What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a processing chamber in which predetermined processing is performed on a substrate and which is vacuum-exhaustible;   a wet surface forming device which forms a surface wet with a cooling medium on a rear surface of a temperature adjustment surface of a component member in the processing chamber;   an evaporation chamber which isolates the wet surface from an atmosphere around the wet surface; and   a pressure adjustment device which adjusts a pressure in the evaporation chamber,   wherein the pressure in the evaporation chamber is adjusted by using the pressure adjustment device such that the cooling medium which forms the wet surface is evaporated, thereby controlling a temperature of the temperature adjustment surface due to latent heat of evaporation of the cooling medium.   
     
     
         2 . The substrate processing apparatus of  claim 1 , wherein a plurality of the temperature adjustment surfaces are present on a plurality of places of a surface of the component member, and the wet surface forming device, the evaporation chamber, and the pressure adjustment device are provided on each of the plurality of temperature adjustment surfaces. 
     
     
         3 . The substrate processing apparatus of  claim 1 , wherein the pressure adjustment device adjusts the pressure in the evaporation chamber to a pressure lower than a saturated vapor pressure of the cooling medium. 
     
     
         4 . The substrate processing apparatus of  claim 1 , wherein a vapor discharge passage through which a vapor obtained by evaporating the cooling medium is discharged to the outside of the evaporation chamber is connected to the evaporation chamber. 
     
     
         5 . The substrate processing apparatus of  claim 1 , wherein the wet surface forming device is a cooling medium spray device which forms the wet surface by spraying the cooling medium to the rear surface of the temperature adjustment surface. 
     
     
         6 . The substrate processing apparatus of  claim 1 , wherein the wet surface forming device comprises a cooling medium container in which at least a part of the rear surface of the temperature adjustment surface is immersed in the cooling medium, and forms the wet surface by supplying the cooling medium to the rear surface of the temperature adjustment surface due to surface tension of the cooling medium. 
     
     
         7 . The substrate processing apparatus of  claim 1 , wherein the wet surface forming device is a shower device which forms the wet surface by spraying the cooling medium to the rear surface of the temperature adjustment surface. 
     
     
         8 . The substrate processing apparatus of  claim 1 , wherein the wet surface forming device has a porous film provided on the rear surface of the temperature adjustment surface and forms the wet surface by supplying the cooling medium to the rear surface of the temperature adjustment surface through the porous film. 
     
     
         9 . The substrate processing apparatus of  claim 1 , wherein the component member in the processing chamber is a substrate holding stage on which the substrate is held or a shower head which faces the substrate holding stages with a processing space therebetween. 
     
     
         10 . The substrate processing apparatus of  claim 1 , wherein the cooling medium is water. 
     
     
         11 . A temperature adjustment method comprising:
 forming a surface wet with a cooling medium by supplying the cooling medium to a rear surface of a temperature adjustment surface of a component member in a processing chamber of a substrate processing device comprising the processing chamber which performs predetermined processing on a substrate and is vacuum-exhaustible; and   adjusting a temperature of the temperature adjustment surface due to latent heat of evaporation of the cooling medium by evaporating the cooling medium which forms the wet surface by adjusting a pressure in an evaporation chamber which isolates the wet surface from an atmosphere around the wet surface.   
     
     
         12 . The temperature adjustment method of  claim 11 , wherein the forming of the wet surface comprises controlling the temperature of the temperature adjustment surface based on the pressure in the evaporation chamber and/or an amount of the cooling medium supplied. 
     
     
         13 . The temperature adjustment method of  claim 12 , wherein after the pressure in the evaporation chamber is set to a pressure lower than a saturated vapor pressure of the cooling medium, the amount of the cooling medium supplied is adjusted, thereby controlling the temperature of the temperature adjustment surface.