Apparatus for forming asymmetrical encapsulant beads on wire bonds

Abstract

An apparatus for forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors. The micro-electronic device has a planar active surface with functional elements. The apparatus includes: a tiltable table for supporting the micro-electronic device, the table being configured for tilting the planar active surface at a predetermined angle relative to the horizontal; and a jetter positioned above the tiltable structure for jetting drops of encapsulant material onto the series of wire bonds.

1 . An apparatus for forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface with functional elements, the apparatus comprising:
 a tiltable table for supporting the micro-electronic device, said table being configured for tilting the planar active surface at a predetermined angle relative to the horizontal;   a fetter positioned above the tiltable structure for jetting drops of encapsulant material onto the series of wire bonds.   
     
     
         2 . The apparatus according to  claim 1 , wherein the table is configured for tilting the planar active surface at an inclination of 10 to 15 degrees relative to the horizontal. 
     
     
         3 . The apparatus according to  claim 1  further comprising a fan for inducing an air flow in a predetermined direction away from the series of wire bonds. 
     
     
         4 . The apparatus according to  claim 1 , wherein the encapsulant is an epoxy material having a viscosity greater than 700 cp when uncured. 
     
     
         5 . The apparatus according to  claim 1 , wherein the encapsulant is an epoxy material that is thixotropic when uncured. 
     
     
         6 . The apparatus according to  claim 1 , wherein the microelectronic device is an inkjet printhead IC and the functional elements are inkjet.