Inventor · disambiguated record
Laval Chung-Long-Shan
Also filed as: CHUNG-LONG-SHAN LAVAL
15 granted patents·4 pending applications·98 citations·filing 2007–2011
92Inventor score
Top patents by PatentIndex Score
19 records- 0195US7824013B2Integrated circuit support for low profile wire bondSILVERBROOK RES PTY LTD·Filed 2007·Granted Nov 2, 2010·23 cites·13 claims
- 0288US7946465B2Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boardsSILVERBROOK RES PTY LTD·Filed 2008·Granted May 24, 2011·11 cites·15 claims
- 0386US7802715B2Method of wire bonding an integrated circuit die and a printed circuit boardSILVERBROOK RES PTY LTD·Filed 2010·Granted Sep 28, 2010·8 cites·15 claims
- 0485US7659141B2Wire bond encapsulant application controlSILVERBROOK RES PTY LTD·Filed 2007·Granted Feb 9, 2010·12 cites·17 claims
- 0582US8063318B2Electronic component with wire bonds in low modulus fill encapsulantWILLIAMS SUSAN·Filed 2009·Granted Nov 22, 2011·13 cites·18 claims
- 0682US7988033B2Method of reducing wire bond profile height in integrated circuits mounted to circuit boardsSILVERBROOK RES PTY LTD·Filed 2007·Granted Aug 2, 2011·11 cites·16 claims
- 0778US7875504B2Method of adhering wire bond loops to reduce loop heightSILVERBROOK RES PTY LTD·Filed 2008·Granted Jan 25, 2011·8 cites·17 claims
- 0871US7832838B2Printhead with exterior surface profiled for wiping maintenance stationSILVERBROOK RES PTY LTD·Filed 2008·Granted Nov 16, 2010·3 cites·8 claims
- 0969US7741720B2Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boardsSILVERBROOK RES PTY LTD·Filed 2008·Granted Jun 22, 2010·3 cites·15 claims
- 1064US8039974B2Assembly of electronic componentsSILVERBROOK RES PTY LTD·Filed 2010·Granted Oct 18, 2011·1 cites·14 claims
- 1163US7669751B2Method of forming low profile wire bonds between integrated circuits dies and printed circuit boardsSILVERBROOK RES PTY LTD·Filed 2008·Granted Mar 2, 2010·2 cites·16 claims
- 1261US8025204B2Method of wire bond encapsulation profilingSILVERBROOK RES PTY LTD·Filed 2007·Granted Sep 27, 2011·2 cites·15 claims
- 1359US7618842B2Method of applying encapsulant to wire bondsSILVERBROOK RES PTY LTD·Filed 2007·Granted Nov 17, 2009·1 cites·18 claims
- 1454US7803659B2Method of encapsulating wire bondsSILVERBROOK RES PTY LTD·Filed 2009·Granted Sep 28, 2010·0 cites·17 claims
- 1549US2012018905A1Electronic component assembly having profiled encapsulated bondsSILVERBROOK KIA·Filed 2011·Application pending·0 cites
- 1646US2011025778A1Printhead assembly with profiled exterior surfaceSILVERBROOK RES PTY LTD·Filed 2010·Application pending·0 cites
- 1745US2009079097A1Electronic component with wire bonds in low modulus fill encapsulantSILVERBROOK RES PTY LTD·Filed 2008·Application pending·0 cites
- 1842US2012048185A1Apparatus for forming asymmetrical encapsulant beads on wire bondsWILLIAMS SUSAN·Filed 2011·Application pending·0 cites
- 1939US8293589B2Wire bond encapsulant control methodCHUNG-LONG-SHAN LAVAL·Filed 2010·Granted Oct 23, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →