Circuit structure

Abstract

A circuit structure suitable for being disposed on a carrier board. The circuit structure comprises a first patterned conductive layer, a second patterned conductive layer, and a solder mask. The first patterned conductive layer is disposed on the carrier board. The second patterned conductive layer is disposed on a part of the first patterned conductive layer. A part of the edge of the second patterned conductive layer and a part of the edge of the first patterned conductive layer are substantially coplanar. The patterned solder mask covers a part of the first patterned conductive layer and has at least one opening for exposing the second patterned conductive layer and a part of the first patterned conductive layer adjacent to the second patterned conductive layer.

1 . A circuit structure, suitable for being disposed on a carrier board, comprising:
 a first patterned conductive layer disposed on the carrier board;   a second patterned conductive layer disposed on a part of the first patterned conductive layer, a part of the edge of the second patterned conductive layer and a part of the edge of the first patterned conductive layer are substantially coplanar; and   a patterned solder mask covering a part of the first patterned conductive layer, the patterned solder mask having at least one opening for exposing the second patterned conductive layer and a part of the first patterned conductive layer adjacent to the second patterned conductive layer.   
     
     
         2 . The circuit structure according to  claim 1 , wherein the material of the first patterned conductive layer is one of copper, aluminum, gold, platinum, nickel, silver, tin, alloy of the above metals, and any combination thereof. 
     
     
         3 . The circuit structure according to  claim 1 , wherein the material of the second patterned conductive layer is the same as the material of the first patterned conductive layer. 
     
     
         4 . The circuit structure according to  claim 1 , further comprising a base conductive layer disposed between the first patterned conductive layer and the carrier board.