Inventor · disambiguated record
Chih-Peng Fan
Also filed as: FAN CHIH-PENG · Fan Chih-Peng (NMI)
15 granted patents·13 pending applications·541 citations·filing 1999–2022
94Inventor score
Files withUNIMICRON TECHNOLOGY CORP12FAN CHIH-PENG6IND TECH RES INST2HSIEH CHING-HO1HSIEH CHING-HO (NMI)1
Top patents by PatentIndex Score
28 records- 0196US6506632B1Method of forming IC package having downward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·164 cites·22 claims
- 0291US6506633B1Method of fabricating a multi-chip module packageUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·81 cites·26 claims
- 0389US6709897B2Method of forming IC package having upward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Mar 23, 2004·64 cites·30 claims
- 0489US6395633B1Method of forming micro-viaWORLD WISER ELECTRICS INC·Filed 2001·Granted May 28, 2002·96 cites·17 claims
- 0587US7700986B2Chip package carrier and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Apr 20, 2010·17 cites·22 claims
- 0686US6749737B2Method of fabricating inter-layer solid conductive rodsUNIMICRON TAIWAN CORP·Filed 2001·Granted Jun 15, 2004·45 cites·11 claims
- 0783US6696886B1Automatically adjusting gain/bandwidth loop filterIND TECH RES INST·Filed 2003·Granted Feb 24, 2004·43 cites·20 claims
- 0878US8289725B2Package substrate having embedded capacitorFAN CHIH-PENG·Filed 2010·Granted Oct 16, 2012·4 cites·10 claims
- 0969US7471640B2Scalable QAM system and methodIND TECH RES INST·Filed 2003·Granted Dec 30, 2008·13 cites·14 claims
- 1061US7906200B2Composite circuit substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Mar 15, 2011·2 cites·6 claims
- 1154US2009008135A1Circuit substrateUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1254US2005098262A1Method of laminating copper foil onto a printed circuit boardFiled 2004·Application pending·0 cites
- 1353US9420690B2ConnectorUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Aug 16, 2016·0 cites·15 claims
- 1452US2008160334A1Circuit substrate and surface treatment process thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1551US8186049B2Method of making a circuit structureFAN CHIH-PENG·Filed 2008·Granted May 29, 2012·2 cites·6 claims
- 1651US2008121417A1Package substrate having embedded capacitorUNIMICRON TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1748US2023068160A1Package carrier and package structureSUBTRON TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 1848US2010044083A1Build-up printed circuit board structure for increasing fine circuit density and method of manufacturing the sameFAN CHIH-PENG·Filed 2009·Application pending·0 cites
- 1945US9370099B2Manufacturing method of connectorUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Jun 14, 2016·0 cites·10 claims
- 2043US2012073867A1Circuit structureFAN CHIH-PENG·Filed 2011·Application pending·0 cites
- 2139US9184520B2Electrical connectorUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Nov 10, 2015·0 cites·14 claims
- 2237US6343304B1Apparatus with selective fixed-coefficient filter for performing recursive discrete cosine transformsNAT SCIENCE COUNCIL·Filed 1999·Granted Jan 29, 2002·10 cites·29 claims
- 2337US2003006007A1Method of laminating copper foil onto a printed circuit boardFiled 2001·Application pending·0 cites
- 2431US2016344118A1Separable Electrical Connector and Method of Making ItHSIEH CHING-HO (NMI)·Filed 2016·Application pending·0 cites
- 2530US2013029500A1Connector and fabrication method thereofFAN CHIH-PENG·Filed 2012·Application pending·0 cites
- 2630US2016380372A1Electrical Connector for USB and other external interface and method of makingHSIEH CHING-HO·Filed 2016·Application pending·0 cites
- 2729US2014335705A1Electrical connectorUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2829US2017194721A1Electrical Connector and Method of Making ItFAN CHIH-PENG·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chih-Peng Fan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →