Substrate edge treatment for coater/developer

Abstract

A method of substrate edge treatment includes forming a processing target film on a treatment target substrate, applying an energy line to a predetermined position on the processing target film to form a latent image on the processing target film, heating the treatment target substrate in which the latent image is formed on the processing target film, developing the processing target film after the heating, inspecting whether a residue is present at an edge of the treatment target substrate after the developing, and cleaning an end of the treatment target substrate to remove the residue at the edge of the treatment target substrate determined to be defective in the inspecting.

1 - 9 . (canceled) 
     
     
         10 . A method of substrate edge treatment comprising:
 forming a processing target film on a treatment target substrate;   inspecting whether the processing target film is adhered to a rear surface at an edge of the treatment target substrate after said forming a processing target film;   cleaning an end of the treatment target substrate to remove a residue at the edge of the treatment target substrate determined to be defective in said inspecting;   applying an energy line to a predetermined position on the processing target film with respect to the treatment target substrate determined to be defective in said inspecting or with respect to the treatment target substrate determined to be defective in said inspecting and cleaned at the end thereof, thereby forming a latent image on the processing target film;   heating the treatment target substrate in which the latent image is formed on the processing target film; and   developing the processing target film after said heating.   
     
     
         11 . The method according to  claim 10 , further comprising cleaning a rear surface of the treatment target substrate between said forming a processing target film and said inspecting. 
     
     
         12 . The method according to  claim 10 , wherein the processing target film is a resist film. 
     
     
         13 . The method according to  claim 10 , wherein said forming the latent image includes using liquid immersion exposure. 
     
     
         14 . The method according to  claim 10 , wherein said cleaning an end of the treatment target substrate includes:
 sucking/holding a rear surface of the treatment target substrate to rotate the treatment target substrate; and   supplying a cleaning liquid to the treatment target substrate at an edge of a front surface thereof and an edge of the rear surface thereof.   
     
     
         15 . The method according to  claim 14 , wherein supplying a cleaning liquid to the target substrate at an edge of a front surface thereof includes discharging the cleaning liquid along a rotating direction of the treatment target substrate. 
     
     
         16 . The method according to  claim 14 , wherein said supplying a cleaning liquid to the target substrate at an edge of the front surface thereof includes using a nozzle to supply the cleaning liquid so that the cleaning liquid is discharged toward the outside of the treatment target substrate apart from a tangential line at a projection position on a circular orbit described when the nozzle is vertically projected onto the treatment target substrate. 
     
     
         17 . The method according to  claim 14 , wherein said supplying a cleaning liquid to the target substrate at an edge of the rear surface includes supplying the cleaning liquid toward the edge from a central part. 
     
     
         18 . The method according to  claim 10 , wherein said cleaning an end of the treatment target substrate includes:
 sucking/holding the rear surface of the treatment target substrate by a chuck to rotate the treatment target substrate;   supplying the cleaning liquid to the treatment target substrate at an edge of a front surface thereof and an edge of the rear surface thereof; and   supplying pure water onto a main surface of the treatment target substrate.   
     
     
         19 . The method according to  claim 18 , wherein said supplying the cleaning liquid to the treatment target substrate includes preparing a hollow annular member surrounding the edge of the treatment target substrate and supplying/holding the cleaning liquid into/in the hollow annular member.