Inventor · disambiguated record
Tomoyuki Takeishi
Also filed as: TAKEISHI TOMOYUKI
19 granted patents·15 pending applications·79 citations·filing 2002–2025
93Inventor score
Top patents by PatentIndex Score
34 records- 0186US7727853B2Processing method, manufacturing method of semiconductor device, and processing apparatusTOSHIBA KK·Filed 2008·Granted Jun 1, 2010·10 cites·6 claims
- 0285US7851363B2Pattern forming method and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2005·Granted Dec 14, 2010·7 cites·28 claims
- 0383US9202722B2Pattern forming method and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Granted Dec 1, 2015·3 cites·19 claims
- 0479US8728943B2Pattern forming method and manufacturing method of semiconductor deviceTAKEISHI TOMOYUKI·Filed 2010·Granted May 20, 2014·3 cites·13 claims
- 0575US6742944B2Alkaline solution and manufacturing method, and alkaline solution applied to pattern forming method, resist film removing method, solution application method, substrate treatment method, solution supply method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2002·Granted Jun 1, 2004·13 cites·12 claims
- 0674US7399578B2Alkaline solution and manufacturing method, and alkaline solution applied to pattern forming method, resist film removing method, solution application method, substrate treatment method, solution supply method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2006·Granted Jul 15, 2008·3 cites·5 claims
- 0771US7527918B2Pattern forming method and method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2004·Granted May 5, 2009·11 cites·6 claims
- 0871US7364839B2Method for forming a pattern and substrate-processing apparatusTOSHIBA KK·Filed 2003·Granted Apr 29, 2008·10 cites·32 claims
- 0970US7709383B2Film forming method, and substrate-processing apparatusTOSHIBA KK·Filed 2005·Granted May 4, 2010·3 cites·20 claims
- 1069US7288466B2Processing method, manufacturing method of semiconductor device, and processing apparatusTOSHIBA KK·Filed 2003·Granted Oct 30, 2007·11 cites·22 claims
- 1166US2023187255A1Semiconductor device and manufacturing method of semiconductor deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1265US9535328B2Developing apparatus and developing methodTOSHIBA KK·Filed 2014·Granted Jan 3, 2017·1 cites·20 claims
- 1365US8084194B2Substrate edge treatment for coater/developerTAKEISHI TOMOYUKI·Filed 2007·Granted Dec 27, 2011·2 cites·2 claims
- 1465US2025259877A1Semiconductor device and manufacturing method of semiconductor deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 1563US7794923B2Substrate processing method, substrate processing apparatus, and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2007·Granted Sep 14, 2010·1 cites·18 claims
- 1660US12400981B2Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Granted Aug 26, 2025·0 cites·14 claims
- 1760US9897918B2Pattern forming method and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Feb 20, 2018·0 cites·58 claims
- 1858US9601331B2Pattern forming method and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2015·Granted Mar 21, 2017·0 cites·24 claims
- 1956US2023395499A1Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2023·Application pending·0 cites
- 2055US2023395498A1Semiconductor storage device and manufacturing method thereofKIOXIA CORP·Filed 2023·Application pending·0 cites
- 2155US2023411344A1Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 2255US2023397425A1Semiconductor storage device, method of manufacturing semiconductor storage device, and semiconductor waferKIOXIA CORP·Filed 2023·Application pending·0 cites
- 2352US7968272B2Semiconductor device manufacturing method to form resist patternTOSHIBA KK·Filed 2006·Granted Jun 28, 2011·0 cites·4 claims
- 2452US2008035851A1Processing method, manufacturing method of semiconductor device, and processing apparatusTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2552US2008050677A1Processing method, manufacturing method of semiconductor device, and processing apparatusTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2650US2011229826A1Semiconductor device manufacturing method to form resist pattern, and substrate processing apparatusKAWAMURA DAISUKE·Filed 2011·Application pending·0 cites
- 2748US7097960B2Alkaline solution and manufacturing method, and alkaline solution applied to pattern forming method, resist film removing method, solution application method, substrate treatment method, solution supply method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2004·Granted Aug 29, 2006·1 cites·6 claims
- 2843US10350624B2Coating apparatus and coating methodTOSHIBA MEMORY CORP·Filed 2016·Granted Jul 16, 2019·0 cites·7 claims
- 2943US2014242793A1Pattern forming method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 3040US2006194449A1Resist pattern forming method and method of manufacturing semiconductor deviceTAKEISHI TOMOYUKI·Filed 2006·Application pending·0 cites
- 3139US2005069815A1Processing method and semiconductor manufacturing methodFiled 2004·Application pending·0 cites
- 3238US2012077128A1Substrate edge treatment for coater/developerTAKEISHI TOMOYUKI·Filed 2011·Application pending·0 cites
- 3336US2006008746A1Method for manufacturing semiconductor deviceONISHI YASUNOBU·Filed 2005·Application pending·0 cites
- 3434US2016217997A1Substrate processing device, recordng medium, and control methodTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →