Light-Emitting Diode Package Assembly

Abstract

An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.

1 - 17 . (canceled) 
     
     
         18 . A process to assemble an electrical device comprising a plurality of light emitting diode (LED) dies each having respective first connectors and second connectors that are suitable for receiving electrical current through respective of the LED dies, the process comprising:
 providing a common base layer of a first electrically conductive material wherein said base layer has a principle side, the principle side comprising a flat surface;   making a plurality of cavities in said principle side of said base layer;   mounting at least one of the plurality of LED dies into each of said plurality of cavities with a conductive bonding material electrically connecting the second connectors of the LED dies to said first conductive material of said base layer; the LED dies having a top surface with the first conductors located in central region;   providing a transparent flat insulator over said principle side of said base layer, the transparent flat insulating layer contacting a top surface of the LED dies but not filling the cavities;   forming apertures in said transparent flat insulator exposing the first conductors but not otherwise exposing the top surfaces of the LED dies;   providing at least one patterned flat over-layer of a second electrically conductive material over transparent flat insulator, the over-later extending into said apertures and contacting said first connectors.   
     
     
         19 . The process of  claim 18 , wherein:
 said making includes shaping at least some of said plurality of cavities to receive light from the at least one of the plurality of LED dies mounted therein and reflect said light out of the electrical device.   
     
     
         20 . The process of  claim 18 , wherein:
 said making includes sizing at least some of said plurality of cavities to mountably contain more than one of said plurality of LED dies.   
     
     
         21 . The process of  claim 18 , wherein:
 said flat over-layer comprises metal plating.   
     
     
         22 . The process of  claim 18 , further comprising:
 adding a covering over said plurality of cavities of a material transparent to light emitted by the plurality of LED dies.   
     
     
         23 . The process of  claim 18 , further comprising:
 installing a reflector over said plurality of cavities suitable to collectively receive light emitted by the plurality of LED dies and to redirect said light.