Light emitting diode package and method of making the same

Abstract

The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.

1 .- 20 . (canceled) 
     
     
         21 . A light emitting diode (LED) chip package, comprising:
 a substrate;   a first LED chip and a second LED chip on the substrate; and   a plurality of phosphors, disposed on the first LED chip and the second LED chip to form a phosphor layer,   wherein a density of the phosphors in a top portion of the first LED chip is higher than a density of the phosphors in a periphery portion of the first LED chip.   
     
     
         22 . The LED chip package of  claim 21 , wherein a density of the phosphors in the top portion of the first LED chip is higher than a density of the phosphors in a top portion of the second LED chip.