Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium

Abstract

When a host issues an analysis order that specifically instructs the analytical contents to an analytical apparatus (step 401 ), the analytical apparatus collects two types of measurement and/or inspection results from a measurement and/or inspection instrument (steps 403 to 409 ), and in step 411 , the analytical apparatus analyzes the measurement and/or inspection results and optimizes processing conditions of a series of processes related to wafer W. In step 411 , data related to a processing state of a processing apparatus is acquired from the processing apparatus as needed. In step 413 , the measurement and/or inspection results and the optimization results are accumulated in a database, and the optimization results are transmitted to various processing apparatuses (including the measurement and/or inspection instrument). After that, the analytical apparatus sends a processing end notice to the host (step 417 ).

1 . A substrate processing method in which a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward are performed, the method comprising:
 an acquisition process of acquiring information as to whether the exposure processing is performed by liquid immersion exposure or dry exposure; and   an adjustment process of adjusting a processing content of at least part of the plurality of substrate processings in accordance with the acquired information; and   a transmission process of transmitting the adjustment result to an apparatus that performs a relevant processing.   
     
     
         2 . The substrate processing method according to  claim 1 , wherein
 in the adjustment process, at least one of an inspection item, inspection sensitivity and an inspection condition of the inspection processing is switched depending on liquid immersion exposure or dry exposure.   
     
     
         3 . The substrate processing method according to  claim 2 , wherein
 in the case the exposure processing is performed by liquid immersion exposure, at least one of a defect inspection with respect to a pattern defect peculiar to liquid immersion exposure, an abnormality inspection of abnormality of the substrate due to liquid used for liquid immersion exposure, and a remaining liquid inspection of liquid that adheres on the substrate after liquid immersion exposure is added as an inspection item of the inspection processing.   
     
     
         4 . The substrate processing method according to  claim 3 , wherein
 the pattern defect peculiar to liquid immersion exposure includes a stain adhering to an optical element of a projection optical system that comes into contact with the liquid, or a pattern defect due to a bubble or a foreign substance in the liquid,   the abnormality inspection of abnormality of the substrate due to the liquid includes an inspection related to a watermark, a stain due to infiltrating of a material of a film formed on the substrate into the liquid and peeling of a film on the substrate, and   the remaining liquid inspection includes a foreign substance inspection of a foreign substance in remaining liquid on the substrate.   
     
     
         5 . The substrate processing method according to  claim 2 , wherein
 in the case the exposure processing is performed by liquid immersion exposure, the inspection sensitivity of the inspection processing is set slightly higher than that of dry exposure.   
     
     
         6 . The substrate processing method according to  claim 2 , wherein
 an inspection condition of the inspection processing includes at least one of a wavelength of illumination light that illuminates the substrate during the inspection, a detection method, a detection optical system and a detection algorithm.   
     
     
         7 . The substrate processing method according to  claim 6 , wherein
 in the case the exposure processing is performed by liquid immersion exposure, an inspection condition of the inspection processing includes at least one of shortening of a wavelength of the illumination light, selection of a bright field out of bright and dark fields, selection of an electron beam detection method out of an optical detection method and the electron beam detection method, selection of a confocal system, and selection of an image comparison algorithm out of the image comparison algorithm, a design data comparison algorithm and a feature extraction algorithm as a detection algorithm.   
     
     
         8 . The substrate processing method according to  claim 1 , wherein
 the adjustment process includes   a computation process of computing correlativity between information on a monitoring result of a liquid immersion portion during the liquid immersion exposure and information on an inspection result of the inspection processing; and   an optimization process of optimizing at least one of an exposure condition in the exposure processing and an inspection condition in the inspection processing, based on the computed correlativity.   
     
     
         9 . The substrate processing method according to  claim 8 , wherein
 in the optimization process, at least one of inspection frequency and inspection sensitivity of a portion having the high correlativity on the substrate is increased.   
     
     
         10 . The substrate processing method according to  claim 8 , wherein
 in the computation process, correlativity between information on a period of time when each point on the substrate is immersed in liquid and information on an inspection result of the inspection processing is further computed, and   in the optimization process, at least one of an exposure route on the substrate, a film formation condition to the substrate, a liquid removal condition on the substrate after liquid immersion exposure is adjusted based on the correlativity.   
     
     
         11 . The substrate processing method according to  claim 1 , wherein
 in the adjustment process, information on a permissible range of a correction amount used to correct an exposure dose and focus that are set is switched.   
     
     
         12 . The substrate processing method according to  claim 1 , wherein
 in the adjustment process, in the case the exposure processing is performed by the liquid immersion exposure, an inspection processing of a topcoat film that protects a resist film coated on the substrate from liquid is added to an inspection content.   
     
     
         13 . The substrate processing method according to  claim 1 , further comprising:
 a storage process of storing information on a inspection result of the inspection processing, and   a computation process of computing information on occurrence frequency of abnormality at each point within the substrate based on the stored information, wherein   in the adjustment process, inspection frequency at each point within the substrate is increased or decreased based on the computed information on occurrence frequency.   
     
     
         14 . A substrate processing apparatus that performs a substrate processing according to transmitted information using the substrate processing method according to  claim 1 . 
     
     
         15 . An exposure apparatus that performs exposure to a substrate according to transmitted information using the substrate processing method according to  claim 1 . 
     
     
         16 . A measurement and/or inspection apparatus that performs measurement and/or inspection of a substrate according to transmitted information using the substrate processing method according to  claim 1 . 
     
     
         17 . A program that makes a computer execute a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward, the program making the computer execute:
 an acquisition procedure of acquiring information as to whether the exposure processing is performed by liquid immersion exposure or dry exposure;   an adjustment procedure of adjusting of a processing content of at least part of the plurality of substrate processings in accordance with the acquired information; and   a transmission procedure of transmitting the adjustment result to an apparatus that performs a relevant processing.   
     
     
         18 . The program according to  claim 17 , wherein
 in the adjustment procedure, at least one of an inspection item, inspection sensitivity, an inspection condition of the inspection processing is switched depending on liquid immersion exposure or dry exposure.   
     
     
         19 . The program according to  claim 18 , wherein
 in the case the exposure processing is performed by liquid immersion exposure, the inspection sensitivity of the inspection processing is set slightly higher than that of dry exposure.   
     
     
         20 . The program according to  claim 18 , wherein
 the inspection condition of the inspection processing includes at least one of a wavelength of illumination light that illuminates the substrate during the inspection, a detection method, a detection optical system, and a detection algorithm.   
     
     
         21 . The program according to  claim 20 , wherein
 in the case the exposure processing is performed by liquid immersion exposure, an inspection condition of the inspection processing includes at least one of shortening of a wavelength of the illumination light, selection of a bright field out of bright and dark fields, selection of an electron beam detection method out of an optical detection method and the electron beam detection method, selection of a confocal system, and selection of an image comparison algorithm out of the image comparison algorithm, a design data comparison algorithm and a feature extraction algorithm as a detection algorithm.   
     
     
         22 . The program according to  claim 17 , wherein
 in the case the exposure processing is performed by liquid immersion exposure, at least one of a defect inspection with respect to a pattern defect peculiar to liquid immersion exposure, an abnormality inspection of abnormality of the substrate due to liquid used in liquid immersion exposure and a remaining liquid inspection of remaining liquid that adheres on the substrate after liquid immersion exposure is added as an inspection item of the inspection processing.   
     
     
         23 . The program according to  claim 22 , wherein
 the pattern defect peculiar to liquid immersion exposure includes a stain adhering to an optical element of a projection optical system that comes into contact with the liquid, or a pattern defect due to a bubble or a foreign substance in the liquid,   the abnormality inspection of abnormality of the substrate due to the liquid includes an inspection related to a watermark, a stain due to infiltrating of a material of a film formed on the substrate into the liquid and peeling of a film on the substrate, and   the remaining liquid inspection includes a foreign substance inspection of a foreign substance in remaining liquid on the substrate.   
     
     
         24 . The program according to  claim 17 , wherein
 the adjustment procedure includes   a computation procedure of computing correlativity between information on a monitoring result of a liquid immersion portion during the liquid immersion exposure and information on an inspection result of the inspection processing; and   an optimization procedure of optimizing at least one of an exposure condition in the exposure processing and an inspection condition in the inspection processing based on the computed correlativity.   
     
     
         25 . The program according to  claim 24 , wherein
 in the optimization procedure, at least one of inspection frequency and inspection sensitivity of a portion having the high correlation on the substrate is increased.   
     
     
         26 . The program according to  claim 24 , wherein
 in the computation procedure, correlativity between information on a period of time when each point on the substrate is immersed in liquid and information on an inspection result of the inspection processing is further computed, and   in the optimization procedure, at least one of an exposure route on the substrate, a film formation condition to the substrate, a liquid removal condition on the substrate after liquid immersion exposure is adjusted.   
     
     
         27 . The program according to  claim 17 , wherein
 in the adjustment procedure, information on a permissible range of a correction amount used to correct an exposure dose and focus that are set is switched.   
     
     
         28 . The program according to  claim 17 , wherein
 in the adjustment procedure, in the case the exposure processing is performed by the liquid immersion exposure, an inspection processing of a topcoat film that protects a resist film coated on the substrate from liquid is added to an inspection content.   
     
     
         29 . The program according to  claim 17 , further making the computer execute:
 a storage procedure of storing information on a inspection result of the inspection processing, and   a computation procedure of computing information on occurrence frequency of abnormality at each point within the substrate based on the stored information, wherein   in the adjustment procedure, inspection frequency at each point within the substrate is increased or decreased based on the computed information on occurrence frequency.   
     
     
         30 . A computer-readable information recording medium in which the program according to  claim 17  is recorded. 
     
     
         31 . A program that makes a computer system execute a processing process of a specific processing in which the specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light on the substrate without liquid is executed to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid, the program making the computer system execute:
 a procedure of changing whether or not to execute the specific processing in the processing process to a substrate based on information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.   
     
     
         32 . The program according to  claim 31 , wherein
 the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.   
     
     
         33 . The program according to  claim 32 , wherein
 the inspection processing includes an inspection of a water repellent film that is formed on the substrate.   
     
     
         34 . The program according to  claim 32 , wherein
 the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.   
     
     
         35 . The program according to  claim 31 , wherein
 the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.   
     
     
         36 . A computer-readable information recording medium in which a program that makes a computer system execute a processing process of a specific processing in which the specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light to the substrate without liquid is executed to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid is recorded, wherein
 the program is a program that makes the computer system execute a procedure of changing whether or not to execute the specific processing in the processing process to a substrate based on information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.   
     
     
         37 . The information recording medium according to  claim 36 , wherein
 the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.   
     
     
         38 . The information recording medium according to  claim 37 , wherein
 the inspection processing includes an inspection of a water repellent film that is formed on the substrate.   
     
     
         39 . The information recording medium according to  claim 37 , wherein
 the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.   
     
     
         40 . The information recording medium according to  claim 36 , wherein
 the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.   
     
     
         41 . A measurement and/or inspection system that implements at least one of a measurement processing and an inspection processing to a substrate that is subject to one of a liquid immersion exposure processing of exposing the substrate with exposure light via liquid and a dry exposure processing of irradiating exposure light on the substrate without liquid, the system comprising:
 a specific measurement and/or inspection section that executes a specific measurement and/or inspection processing that is unnecessary for a substrate that is subject to the dry exposure processing to a substrate that is subject to the liquid immersion exposure processing, wherein   whether or not the specific measurement and/or inspection section executes the specific measurement and/or inspection processing is changed, in accordance with information that shows whether a substrate is subject to the liquid immersion exposure processing or the dry exposure processing.   
     
     
         42 . The measurement and/or inspection system according to  claim 41 , wherein
 the measurement and/or inspection processing includes an inspection of a water repellent film that is formed on the substrate.   
     
     
         43 . The measurement and/or inspection system according to  claim 41 , wherein
 the measurement and/or inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.   
     
     
         44 . A processing apparatus that executes a specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light to the substrate without liquid to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid, wherein
 whether or not to execute the specific processing to a substrate is changed in accordance with information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.   
     
     
         45 . The processing apparatus according to  claim 44 , wherein
 the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.   
     
     
         46 . The processing apparatus according to  claim 45 , wherein
 the inspection processing includes an inspection of a water repellent film that is formed on the substrate.   
     
     
         47 . The processing apparatus according to  claim 45 , wherein
 the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.   
     
     
         48 . The processing apparatus according to  claim 44 , wherein
 the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.   
     
     
         49 . A computer system that controls a processing process of a specific processing in which the specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light to the substrate without liquid is executed to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid, wherein
 whether or not to execute the specific processing in the processing process to a substrate is changed in accordance with information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.   
     
     
         50 . The computer system according to  claim 49 , wherein
 the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.   
     
     
         51 . The computer system according to  claim 50 , wherein
 the inspection processing includes an inspection of a water repellent film that is formed on the substrate.   
     
     
         52 . The computer system according to  claim 50 , wherein
 the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.   
     
     
         53 . The computer system according to  claim 49 , wherein the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.