Silicon target for sputtering film formation and method for forming silicon-containing thin film

Abstract

A silicon target for sputtering film formation which enables formation of a high-quality silicon-containing thin film by inhibiting dust generation during sputtering film formation is provided. An n-type silicon target material 10 and a metallic backing plate 20 are attached to each other via a bonding layer 40 . A conductive layer 30 made of a material having a smaller work function than that of the silicon target material 10 is provided on a surface of the silicon target material 10 on the bonding layer 40 side. That is, the silicon target material 10 is attached to the metallic backing plate 20 via the conductive layer 30 and the bonding layer 40 . In a case of single-crystal silicon, a work function of n-type silicon is generally 4.05 eV. A work function of a material of the conductive layer 30 needs to be smaller than 4.05 eV.

1 . A silicon target for sputtering film formation in which a silicon target material is attached to a metallic backing plate via a bonding material,
 wherein the silicon target material is made of silicon whose conductive type is n-type, and   a conductive layer made of a material having a smaller work function than that of the silicon target material is provided on a surface of the silicon target material on the bonding material side.   
     
     
         2 . The silicon target for sputtering film formation according to  claim 1 , wherein the conductive layer contains one of a lanthanoid element, a rare-earth element, an alkali metal element, and an alkali-earth metal element. 
     
     
         3 . The silicon target for sputtering film formation according to  claim 1 , wherein the conductive layer contains one of Y and lanthanoid. 
     
     
         4 . The silicon target for sputtering film formation according to  claim 1 , wherein the silicon target material has a volume resistivity of 1 Ωcm or more as electric resistance at a room temperature. 
     
     
         5 . The silicon target for sputtering film formation according to  claim 1 , wherein the silicon target material is single crystal. 
     
     
         6 . A method for forming a silicon-containing thin film, wherein sputtering is performed by a gas containing nitrogen and argon by using a target according to  claim 1 . 
     
     
         7 . The silicon target for sputtering film formation according to  claim 2 , wherein the silicon target material has a volume resistivity of 1 Ωcm or more as electric resistance at a room temperature. 
     
     
         8 . The silicon target for sputtering film formation according to  claim 2 , wherein the silicon target material is single crystal. 
     
     
         9 . A method for forming a silicon-containing thin film, wherein sputtering is performed by a gas containing nitrogen and argon by using a target according to  claim 2 . 
     
     
         10 . The silicon target for sputtering film formation according to  claim 3 , wherein the silicon target material has a volume resistivity of 1 Ωcm or more as electric resistance at a room temperature. 
     
     
         11 . The silicon target for sputtering film formation according to  claim 3 , wherein the silicon target material is single crystal. 
     
     
         12 . A method for forming a silicon-containing thin film, wherein sputtering is performed by a gas containing nitrogen and argon by using a target according to  claim 3 .