Wiring board with built-in electronic component and method for manufacturing the same

Abstract

A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole.

1 . A method for manufacturing a wiring board with a built-in electronic component, comprising:
 forming a penetrating hole configured to accommodate an electronic component in a core substrate;   forming a conductive pattern layer including a first conductive pattern and a second conductive pattern on a first surface of the core substrate such that the second conductive pattern is formed adjacent to a periphery of the penetrating hole and configured to laminate a sheet for positioning the electronic component in the penetrating hole horizontally with respect to the first surface of the core substrate over the penetrating hole;   laminating the sheet over the first surface of the core substrate;   mounting the electronic component on the sheet forming a bottom of the penetrating hole;   filling a resin material in a gap between the electronic component and the core substrate to secure the electronic component in the penetrating hole; and   removing the sheet after the electronic component is secured.   
     
     
         2 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , further comprising:
 forming an interlayer insulation layer and a conductive pattern over a second surface opposite to the first surface of the core substrate; and   forming a via conductor in the interlayer insulation layer over the second surface of the core substrate such that a terminal of the electronic component is electrically connected to the conductive pattern over the second surface of the core substrate.   
     
     
         3 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern in a plurality of portions facing each other across the penetrating hole. 
     
     
         4 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern configured to frame the periphery of the penetrating hole. 
     
     
         5 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern configured to frame the periphery of the penetrating hole in a continuous line. 
     
     
         6 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern configured to frame the periphery of the penetrating hole in a broken line. 
     
     
         7 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming a side surface of the second conductive pattern on substantially a same level as an inner-wall surface of the core substrate defining the penetrating hole. 
     
     
         8 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern which has a portion protruding into the penetrating hole. 
     
     
         9 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern configured to maintain a space from an outline of the penetrating hole. 
     
     
         10 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern having a maximum width which is made greater than a maximum width of the first conductive pattern. 
     
     
         11 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the sheet comprises an adhesive tape which is a UV tape having adhesiveness which is reduced when ultraviolet rays are irradiated. 
     
     
         12 . The method for manufacturing a wiring board with a built-in electronic
 component according to  claim 1 , wherein the forming of the conductive pattern layer comprises forming the second conductive pattern having a thickness which is made substantially a same as a thickness of the first conductive pattern.   
     
     
         13 . The method for manufacturing a wiring board with a built-in electronic component according to  claim 1 , wherein the sheet comprises an adhesive tape.