Immersion multiple-exposure method and immersion exposure system for separately performing multiple exposure of micropatterns and non-micropatterns

Abstract

This invention discloses an immersion multiple-exposure method including a first exposure step of performing, using a first mask, immersion exposure of a photoresist film formed on a substrate, a cleaning step of clearing the surface of the substrate, and a second exposure step of performing immersion exposure of the photoresist film using a second mask. No heating process is performed between the first exposure step and the second exposure step.

1 .- 10 . (canceled) 
     
     
         11 . An immersion exposure system comprising:
 a cleaning unit configured to clean a substrate between exposure steps of an immersion multiple-exposure process.   
     
     
         12 . The system according to  claim 11 , wherein
 the cleaning unit cleans the substrate after first immersion exposure is performed using a first mask, and   second immersion exposure is performed using a second mask after the substrate is cleaned.   
     
     
         13 . The system according to  claim 11 , wherein the cleaning unit cleans the substrate while rotating the substrate and spraying pure water. 
     
     
         14 . An immersion exposure system comprising:
 an immersion exposure apparatus;   a coater/development apparatus; and   a cleaning unit provided between the immersion exposure apparatus and the coater/development apparatus to clean a substrate between exposure steps of an immersion multiple-exposure process.   
     
     
         15 . The system according to  claim 14 , wherein the immersion exposure apparatus comprises an illumination light source, a condenser optical system configured to condense irradiation light from the illumination light source, a reticle stage arranged on an exit side of the condenser optical system to accept a photomask, a projection optical system arranged under the reticle stage, and a wafer stage arranged under the projection optical system to accept a wafer. 
     
     
         16 . The system according to  claim 14 , wherein the coater/development apparatus applies a resist to the substrate to form a photoresist film. 
     
     
         17 . The system according to  claim 14 , wherein the cleaning unit cleans the substrate while rotating the substrate and spraying pure water. 
     
     
         18 . The system according to  claim 14 , wherein
 the cleaning unit cleans the substrate by spraying pure water after the immersion exposure apparatus performs first immersion exposure using a first mask, and   the immersion exposure apparatus performs second immersion exposure using a second mask after the substrate is cleaned.