US2012175162A1PendingUtilityA1

Printed circuit board

47
Assignee: MOK JEE SOOPriority: May 29, 2007Filed: Mar 23, 2012Published: Jul 12, 2012
Est. expiryMay 29, 2027(~0.9 yrs left)· nominal 20-yr term from priority
Inventors:Jee-Soo MokJun Heyoung Park
Y10T29/49156H05K 2203/1461H05K 2203/0278H05K 3/4069H05K 2201/0376H05K 2201/0355H05K 3/386Y10T29/49163Y10T156/109Y10T29/49155H05K 3/4647H05K 3/107
47
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer.

Claims

exact text as granted — not AI-modified
1 . A printed circuit board, comprising:
 an insulating layer;   circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and   a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer.   
     
     
         2 . The printed circuit board as set forth in  claim 1 , wherein the circuit patterns and the insulating layer are adhered using an adhesive. 
     
     
         3 . The printed circuit board as set forth in  claim 2 , wherein the adhesive has a glass transition temperature lower than that of the insulating layer.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.