System to improve an in-line memory module

Abstract

A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

1 . A system comprising:
 an edging carried by an in-line memory module to at least one of stiffen, support, protect, and aid in handling the in-line memory module; and   a guide rib carried by said edging to facilitate positioning of the in-line memory module during installation.   
     
     
         2 . The system of  claim 1  wherein said edging comprises a low profile design to reduce air flow impedance. 
     
     
         3 . The system of  claim 1  wherein said edging comprises flares that control the in-line memory module's installation. 
     
     
         4 . The system of  claim 1  wherein said edging comprises a mounting feature to join said edging to the in-line memory module. 
     
     
         5 . The system of  claim 1  wherein said edging comprises a mounting guidance element to align said edging during joining to the in-line memory module. 
     
     
         6 . The system of  claim 1  wherein said edging comprises a retainer that secures the in-line memory module after its installation. 
     
     
         7 . The system of  claim 1  wherein the in-line memory module comprises at least one of random access memory, application-specific integrated circuit, surface mount components, and heat sink. 
     
     
         8 . A system comprising:
 a heat spreader to aid in cooling a plurality of heat sources carried by an in-line memory module; and   a compliant member to regulate said heat spreader's positioning relative to the plurality of heat sources.   
     
     
         9 . The system of  claim 8  wherein said heat spreader is shaped to contact the plurality of heat sources and to avoid a plurality of non-heat sources. 
     
     
         10 . The system of  claim 8  wherein said heat spreader comprises fins and relief sections without fins that mate with said compliant member. 
     
     
         11 . The system of  claim 10  wherein the relief sections without fins position said compliant member during installation. 
     
     
         12 . The system of  claim 10  wherein the relief sections without fins facilitates tighter pitch between the in-line memory module and another in-line memory module. 
     
     
         13 . The system of  claim 8  further comprising a fastener to connect said compliant member and said heat spreader. 
     
     
         14 . The system of  claim 13  wherein said fastener controls said compliant member's ability to regulate positioning. 
     
     
         15 . The system of  claim 13  wherein said fastener engages a mating surface on said compliant member. 
     
     
         16 . The system of  claim 13  wherein said biasing member provides substantially continuous mechanical loading across said heat spreader. 
     
     
         17 . The system of  claim 8  wherein said heat spreader comprises a plurality of heat spreaders; wherein said compliant member comprises a plurality of compliant members; and wherein one of said plurality of compliant members regulates one of said plurality of heat spreaders on one side of the in-line memory module and another one of said plurality of compliant members regulates another one of said plurality of heat spreaders on the other side of the in-line memory module. 
     
     
         18 . The system of  claim 13  further comprising a fastener to secure both compliant members and both heat spreaders.