US2012261748A1PendingUtilityA1

Semiconductor device with recess gate and method for fabricating the same

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Assignee: LEE SEUNG-MIPriority: Apr 9, 2009Filed: Jun 27, 2012Published: Oct 18, 2012
Est. expiryApr 9, 2029(~2.7 yrs left)· nominal 20-yr term from priority
H10D 64/01346H10D 64/01324H10D 64/511H10D 64/311H10D 64/251H10D 12/038H10D 64/516H10D 30/0217H10D 30/60H10D 64/027H10P 50/282
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Claims

Abstract

A semiconductor device includes a substrate with a recess pattern, a gate electrode filling the recess pattern, a threshold voltage adjusting layer formed in the substrate under the recess pattern, a source/drain region formed in the substrate on both sides of the gate electrode and a gate insulation layer, with the recess pattern being disposed between the gate electrode and the substrate, wherein the thickness of the gate insulation layer formed in a region adjacent to the source/drain region is greater than the thickness of the gate insulation layer formed in a region adjacent to the threshold voltage adjusting layer.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device, comprising:
 a substrate with a recess pattern;   a gate electrode filling the recess pattern;   a threshold voltage adjusting layer formed in the substrate under the recess pattern;   a source/drain region formed in the substrate on both sides of the gate electrode; and   a gate insulation layer, with the recess pattern being disposed between the gate electrode and the substrate, wherein the thickness of the gate insulation layer formed in a region adjacent to the source/drain region is greater than the thickness of the gate insulation layer formed in a region adjacent to the threshold voltage adjusting layer.   
     
     
         2 . The semiconductor device of  claim 1 , wherein the thickness of the gate insulation layer formed in the region adjacent to the threshold voltage adjusting layer is in a range of approximately 70% to approximately 80% of the thickness of the gate insulation layer formed in the region adjacent to the source/drain region. 
     
     
         3 . The semiconductor device of  claim 1 , wherein the gate electrode has a structure filling a portion of the recess pattern, or a structure filling the recess pattern and partially protruding over the substrate. 
     
     
         4 . The semiconductor device of  claim 1 , wherein the recess pattern is any one type selected from the group consisting of a square type, a polygonal type, a bulb type, and a saddle fin type. 
     
     
         5 - 20 . (canceled)

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