High performance resonant element

Abstract

A method of forming a semiconductor device for processing a signal includes providing a circuit board including an input signal line, providing a high performance resonant element connected to the input signal line, and providing an output signal line connected to the high performance resonant element. The high performance resonant element includes a via.

1 . A method of forming a semiconductor device for processing a signal, said method comprising:
 providing a circuit board including an input signal line;   providing a high performance resonant element connected to said input signal line; and   providing an output signal line connected to said high performance resonant element,   wherein said high performance resonant element comprises a via.   
     
     
         2 . The method of  claim 1 , further comprising reducing a length of said via. 
     
     
         3 . The method of  claim 2 , wherein said reducing comprises one of backdrilling and milling of said via. 
     
     
         4 . The method of  claim 2 , wherein said reducing comprises adjusting a thickness of said circuit board. 
     
     
         5 . The method of  claim 1 , wherein said signal comprises a plurality of frequency components. 
     
     
         6 . The method of  claim 5 , wherein said via processes said plurality of frequency component to provide a desired output signal. 
     
     
         7 . The method of  claim 6 , wherein said via attenuates at least one of said plurality of frequency components. 
     
     
         8 . The method of  claim 7 , wherein said at least one of said plurality of frequencies comprises a noise frequency. 
     
     
         9 . The method of  claim 7 , wherein said via permits at least one other of said plurality of frequency components to pass.