Inventor · disambiguated record
Young Hoon Kwark
Also filed as: KWARK YOUNG · KWARK YOUNG H · KWARK YOUNG HOON
31 granted patents·6 pending applications·452 citations·filing 1992–2021
97Inventor score
Top patents by PatentIndex Score
37 records- 0191US6538299B1Silicon-on-insulator (SOI) trench photodiodeIBM·Filed 2000·Granted Mar 25, 2003·59 cites·23 claims
- 0289US9713258B2Integrated circuit chip packagingKWARK YOUNG HOON·Filed 2006·Granted Jul 18, 2017·15 cites·17 claims
- 0388US7375290B1Printed circuit board via with radio frequency absorberKWARK YOUNG HOON·Filed 2006·Granted May 20, 2008·23 cites·14 claims
- 0485US9379342B1Semi-conductor device with programmable responseIBM·Filed 2016·Granted Jun 28, 2016·2 cites·20 claims
- 0585US9379340B1Semiconductor device with programmable responseIBM·Filed 2016·Granted Jun 28, 2016·2 cites·20 claims
- 0683US9318717B1Semi-conductor device with programmable responseIBM·Filed 2015·Granted Apr 19, 2016·2 cites·20 claims
- 0780US6141634AAC power line network simulatorIBM·Filed 1997·Granted Oct 31, 2000·87 cites·16 claims
- 0879US7215133B2Contactless circuit testing for adaptive wafer processingIBM·Filed 2004·Granted May 8, 2007·22 cites·10 claims
- 0978US5937348ACordless communication system for a portable computer modemIBM·Filed 1996·Granted Aug 10, 1999·80 cites·18 claims
- 1077US10600715B2Integrated circuit chip packagingIBM·Filed 2017·Granted Mar 24, 2020·1 cites·19 claims
- 1177US8436701B2Integrated electromechanical relaysBAKS CHRISTIAN WILHELMUS·Filed 2010·Granted May 7, 2013·4 cites·13 claims
- 1277US7303113B2Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacersIBM·Filed 2003·Granted Dec 4, 2007·22 cites·25 claims
- 1375US9714933B2Micro-droplet fluidic cell for fast ionic current detection using nanoporesIBM·Filed 2014·Granted Jul 25, 2017·2 cites·14 claims
- 1473US6967483B2Apparatus and method for determining contact dynamicsIBM·Filed 2004·Granted Nov 22, 2005·16 cites·19 claims
- 1571US2020168524A1Integrated circuit chip packagingIBM·Filed 2020·Application pending·0 cites
- 1671US2020168525A1Integrated circuit chip packagingIBM·Filed 2020·Application pending·0 cites
- 1767US7161344B2Method and structure for variable pitch microwave probe assemblyIBM·Filed 2004·Granted Jan 9, 2007·9 cites·14 claims
- 1866US6128510ACordless connection for a data/fax modemIBM·Filed 1997·Granted Oct 3, 2000·46 cites·18 claims
- 1964US9076615B2Method of forming an integrated electromechanical relayIBM·Filed 2013·Granted Jul 7, 2015·1 cites·6 claims
- 2064US7492143B2Method and structure for variable pitch microwave probe assemblyIBM·Filed 2006·Granted Feb 17, 2009·2 cites·11 claims
- 2163US7854368B2Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacersIBM·Filed 2007·Granted Dec 21, 2010·2 cites·28 claims
- 2263US6112098ACordless or wireless system protocol for providing reliable channel connectionsIBM·Filed 1997·Granted Aug 29, 2000·45 cites·34 claims
- 2359US7977618B2Testing of transimpedance amplifiersIBM·Filed 2009·Granted Jul 12, 2011·1 cites·16 claims
- 2458US10818572B2Integrated circuit chip packaging including a heat sink topped cavityIBM·Filed 2017·Granted Oct 27, 2020·0 cites·20 claims
- 2557US7745775B2Testing of transimpedance amplifiersIBM·Filed 2003·Granted Jun 29, 2010·3 cites·14 claims
- 2656US10967372B2Electro-fluidic flow probeIBM·Filed 2014·Granted Apr 6, 2021·0 cites·13 claims
- 2753US7764062B2Method and structure for variable pitch microwave probe assemblyIBM·Filed 2008·Granted Jul 27, 2010·0 cites·13 claims
- 2850US2023189426A1Integrated Attenuator with Thermal ViasIBM·Filed 2021·Application pending·0 cites
- 2948US10967373B2Electro-fluidic flow probeIBM·Filed 2015·Granted Apr 6, 2021·0 cites·13 claims
- 3047US8525623B2Integrated electromechanical relaysBAKS CHRISTIAN W·Filed 2012·Granted Sep 3, 2013·0 cites·7 claims
- 3146US8089006B2High performance resonant elementGAUCHER BRIAN P·Filed 2006·Granted Jan 3, 2012·0 cites·19 claims
- 3245US2012282749A1High performance resonant elementGAUCHER BRIAN P·Filed 2011·Application pending·0 cites
- 3341US6994570B2High performance interposer for a chip package using deformable button contactsIBM·Filed 2004·Granted Feb 7, 2006·0 cites·37 claims
- 3441US5189296AOptical receiver having a low capacitance integrated photodetectorIBM·Filed 1992·Granted Feb 23, 1993·6 cites·15 claims
- 3540US2007275607A1Compensation for far end crosstalk in data busesKWARK YOUNG H·Filed 2006·Application pending·0 cites
- 3637US7541925B2Mapping system and method for determining optimal radio transponder placementIBM·Filed 2005·Granted Jun 2, 2009·0 cites·26 claims
- 3732US2012274338A1High performance time domain reflectometryBAKS CHRISTIAN W·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →