Integrated circuit chip packaging

Abstract

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit hoard to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip.

What is claimed is: 
     
         1 . A method of mounting an integrated circuit chip to a circuit board, the method comprising:
 placing said integrated circuit chip into a cavity extending from a surface of said circuit board to an embedded conductor:   electrically connecting said integrated circuit chip to said embedded conductor; and   disposing a heat sink over a surface of said integrated circuit chip.   
     
     
         2 . The method of  claim 1 , further comprising providing said cavity in said circuit board. 
     
     
         3 . The method of  claim 2 , wherein said providing said cavity comprises milling said surface of said circuit board to said embedded conductor. 
     
     
         4 . The method of  claim 3 , wherein said providing of said cavity comprises providing said cavity with a side surface that includes a step. 
     
     
         5 . The method of  claim 4 , wherein a top surface of said step is aligned with another embedded conductor. 
     
     
         6 . The method of  claim 4 , wherein a top surface of said step exposes said embedded conductor. 
     
     
         7 . The method of  claim 4 , wherein said electrically connecting comprises electrically connecting said integrated circuit chip to a plurality of embedded conductors in addition to said embedded conductor, 
     
     
         8 . The method of  claim 7 , wherein said electrically connecting said integrated circuit chip to the plurality of embedded conductors comprises providing one of a ribbon bond, a wire bond, and a ball bond. 
     
     
         9 . The method of  claim 1 , wherein said electrically connecting said integrated circuit chip to said embedded conductor comprises flip chip mounting said integrated circuit chip within said cavity. 
     
     
         10 . The method of  claim 1 , wherein a top surface of said integrated circuit chip is located above a side surface of the integrated circuit chip. 
     
     
         11 . The method of  claim 10 , further comprising:
 disposing the heat sink on an outer surface of a thermal slug for transferring a thermal energy away from said circuit board.   
     
     
         12 . The method of  claim 11 , wherein said circuit board is disposed on an upper surface and a lower surface of said embedded conductor. 
     
     
         13 . The method of  claim 1 , wherein said circuit board is disposed on an upper surface and a lower surface of said embedded conductor. 
     
     
         14 . The method of  claim 1 , wherein said integrated circuit chip abuts a bottom surface of a thermal slug. 
     
     
         15 . The method of  claim 14 , wherein, with respect to a bottom surface of said integrated circuit chip, a top surface of the thermal slug is located higher than a top surface of said circuit board. 
     
     
         16 . The method of  claim 1 , further comprising:
 disposing a heat sink on a top surface of a thermal slug for transferring a thermal energy away from said circuit board, the heat sink extending above a top surface of said circuit board,   
     
     
         17 . The method of  claim 16 , further comprising:
 disposing a flip chip package between the top surface of said circuit board and a bottom surface of the heat sink.   
     
     
         18 . The method of  claim 16 , wherein the bottom surface of the heat sink abuts a top surface of the flip chip package. 
     
     
         19 . A method of mounting an integrated circuit chip to a circuit board, the method comprising:
 providing a cavity in the circuit board;   placing the integrated circuit chip into the cavity, the cavity extending from the surface of the circuit board to a conductor embedded in the circuit board;   electrically connecting the integrated circuit chip to the conductor;   disposing a thermal slug on a surface of the integrated circuit chip; and   disposing a heat sink over a surface of said integrated circuit chip.   
     
     
         20 . A method of mounting an integrated circuit chip to a circuit board, the method comprising:
 milling a surface of a circuit board to provide a cavity in the circuit board;   placing the integrated circuit chip into the cavity, the cavity extending from the surface of the circuit board to a conductor embedded in the circuit board;   electrically connecting the integrated circuit chip to the conductor;   disposing a thermal slug on a surface of the integrated circuit chip; and   disposing a flip chip package on a top surface of the circuit board.