Integrated circuit chip packaging

Abstract

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip. The electrically connecting the integrated circuit chip to the embedded conductor includes flip chip mounting of the integrated circuit chip within the cavity.

What is claimed is: 
     
         1 . A method of mounting an integrated circuit chip to a circuit board, the method comprising:
 placing said integrated circuit chip into a cavity extending from a surface of said circuit board to an embedded conductor; and   electrically connecting said integrated circuit chip to said embedded conductor,   wherein said electrically connecting said integrated circuit chip to said embedded conductor comprises flip chip mounting said integrated circuit chip within said cavity.   
     
     
         2 . The method of  claim 1 , further comprising providing said cavity in said circuit board. 
     
     
         3 . The method of  claim 2 , wherein said providing said cavity comprises milling said surface of said circuit board to said embedded conductor. 
     
     
         4 . The method of  claim 3 , wherein said providing of said cavity comprises providing said cavity with a side surface that includes a step. 
     
     
         5 . The method of  claim 4 , wherein a top surface of said step is aligned with another embedded conductor. 
     
     
         6 . The method of  claim 4 , wherein a top surface of said step exposes said embedded conductor. 
     
     
         7 . The method of  claim 1 , further comprising:
 disposing a heat sink over a surface of said integrated circuit chip.   
     
     
         8 . The method of  claim 7 , further comprising:
 disposing the heat sink on an outer surface of a thermal slug for transferring a thermal energy away from said circuit board.   
     
     
         9 . The method of  claim 8 , wherein said integrated circuit chip abuts a bottom surface of the thermal slug. 
     
     
         10 . The method of  claim 8 , wherein, with respect to a bottom surface of said integrated circuit chip, a top surface of the thermal slug is located higher than a top surface of said circuit board. 
     
     
         11 . The method of  claim 1 , wherein said circuit board is disposed on an upper surface and a lower surface of said embedded conductor. 
     
     
         12 . The method of  claim 1 , further comprising:
 disposing a heat sink on a top surface of a thermal slug for transferring a thermal energy away from said circuit board, the heat sink extending above a top surface of said circuit board.   
     
     
         13 . The method of  claim 12 , further comprising:
 disposing a flip chip package between the top surface of said circuit board and a bottom surface of the heat sink.   
     
     
         14 . The method of  claim 13 , wherein the bottom surface of the heat sink abuts a top surface of the flip chip package. 
     
     
         15 . An electrical circuit device, comprising:
 a circuit board including a cavity extending from a surface of said circuit board to an embedded conductor;   an integrated circuit chip disposed in said cavity; and   an electrical connection extending between said integrated circuit chip and said embedded conductor,   wherein said electrical connection comprises a flip chip connection.   
     
     
         16 . The device of  claim 15 , further comprising:
 a thermal slug disposed over a top surface of said integrated circuit chip.   
     
     
         17 . The device of  claim 16 , further comprising:
 a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board.   
     
     
         18 . The device of  claim 16 , further comprising:
 a heat sink mounted over a top surface of said integrated circuit chip for transferring a thermal energy away from the circuit board.   
     
     
         19 . The device of  claim 15 , further comprising:
 a heat sink disposed on a top surface of a thermal slug for transferring a thermal energy away from said circuit board.   
     
     
         20 . The device of  claim 19 , wherein the heat sink extends above a top surface of said circuit board.