Electronic device and method of manufacturing the electronic device

Abstract

An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.

1 . A method of manufacturing an electronic device, comprising:
 (a) providing an element which comprises an optically functional region formed in one face of said element;   (b) forming a transparent layer on said optically functional region;   (c) deforming said transparent layer so that an upper face of said transparent layer is lowered by pressing said upper face of said transparent layer by a sealing die;   (d) injecting a sealing resin into a space formed between said sealing die and said transparent layer, said sealing resin being mixed with filler to form a sealing resin layer; and   (e) removing said sealing die, wherein said transparent layer is subjected to a reverse deformation that raises said upper face of said transparent layer to position above an upper face of said sealing resin layer.   
     
     
         2 . The method according to  claim 1 , wherein step (b) comprises:
 arranging an optically transparent resin film directly on said one face;   patterning said optically transparent resin film to form said transparent layer; and   hardening said transparent layer by performing heating or photoirradiating said transparent layer after said transparent layer is formed.   
     
     
         3 . The method according to  claim 1 , before step (b), the method further comprising:
 providing an optically transparent resin film by overlapping a plurality of film-shaped resins; and   providing said optically transparent resin film directly on said one face of said element.   
     
     
         4 . The method according to  claim 3 , wherein said plurality of said film-shaped resins are overlapped by using a roll laminator method; and
 said optically transparent resin film is provided directly on said one face by using a vacuum laminator method.   
     
     
         5 . The method according to  claim 1 ,
 wherein there are a plurality of said elements, said elements being formed on a wafer;   said transparent layer comprises an optically transparent resin film, said transparent layer being formed on said wafer and patterned for covering said optically functional region of each of said elements; and   the method further comprising cutting away the plurality of said elements from said wafer before step (c).   
     
     
         6 . The method according to  claim 1 , further comprising:
 mounting said element on a wiring substrate before step (c);   wherein step (c) includes:   arranging said element and said wiring substrate between an upper die and a lower die of said sealing die, and arranging a shock-absorbing member between said wiring substrate and said lower die; and   wherein step (d) includes:   sandwiching said element, said wiring substrate, and said shock-absorbing member between said lower die and said upper die while forming said sealing resin layer by injecting said sealing resin into a space between said lower die and said upper die.