Inventor · disambiguated record
Koki Hirasawa
Also filed as: HIRASAWA KOKI
29 granted patents·5 pending applications·233 citations·filing 1999–2017
96Inventor score
Top patents by PatentIndex Score
34 records- 0192US7939935B2Electronic device substrate, electronic device and methods for fabricating the sameHITACHI CABLE·Filed 2007·Granted May 10, 2011·25 cites·24 claims
- 0287US7880091B2Electronic device substrate, electronic device and methods for making sameHITACHI CABLE·Filed 2006·Granted Feb 1, 2011·13 cites·4 claims
- 0385US8101864B2Electronic device substrate and its fabrication method, and electronic device and its fabrication methodCHINDA AKIRA·Filed 2009·Granted Jan 24, 2012·13 cites·7 claims
- 0482US7998781B2Method of manufacturing semiconductor device in which functional portion of element is exposedRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 16, 2011·10 cites·14 claims
- 0579US8243461B2Electronic device and process for manufacturing electronic deviceUCHIDA KENJI·Filed 2009·Granted Aug 14, 2012·7 cites·12 claims
- 0679US7705245B2Electronic device substrate and its fabrication method, and electronic device and its fabrication methodHITACHI CABLE·Filed 2006·Granted Apr 27, 2010·8 cites·12 claims
- 0775US10559722B2Light-emitting deviceCITIZEN ELECTRONICS·Filed 2017·Granted Feb 11, 2020·2 cites·3 claims
- 0875US8230591B2Method for fabricating an electronic device substrateCHINDA AKIRA·Filed 2008·Granted Jul 31, 2012·6 cites·14 claims
- 0971US8230588B2Method of making an electronic device and electronic device substrateMIYAMOTO NOBUAKI·Filed 2009·Granted Jul 31, 2012·5 cites·6 claims
- 1071US6548880B1Optical semiconductor device and a method of manufacturing the sameNEC COMPOUND SEMICONDUCTOR·Filed 2000·Granted Apr 15, 2003·18 cites·16 claims
- 1171US6429043B1Semiconductor circuitry device and method for manufacturing the sameNEC CORP·Filed 2000·Granted Aug 6, 2002·23 cites·5 claims
- 1267US6351026B2Multilayered wiring structure and method of manufacturing the sameNEC CORP·Filed 2001·Granted Feb 26, 2002·13 cites·16 claims
- 1365US10629786B2Light emitting device and manufacturing method thereofCITIZEN ELECTRONICS·Filed 2016·Granted Apr 21, 2020·1 cites·10 claims
- 1464US8252408B2Electronic device and method of manufacturing the electronic deviceUCHIDA KENJI·Filed 2009·Granted Aug 28, 2012·2 cites·5 claims
- 1563US10158056B2LED package, light emitting device and method for manufacturing LED packageCITIZEN ELECTRONICS·Filed 2016·Granted Dec 18, 2018·1 cites·6 claims
- 1663US6340839B1Hybrid integrated circuitNEC CORP·Filed 1999·Granted Jan 22, 2002·29 cites·11 claims
- 1758US6274404B1Multilayered wiring structure and method of manufacturing the sameNEC CORP·Filed 1999·Granted Aug 14, 2001·21 cites·22 claims
- 1857US7880279B2Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the sameNITTO DENKO CORP·Filed 2007·Granted Feb 1, 2011·1 cites·7 claims
- 1957US7291905B2Lead frame, semiconductor device produced by using the same and method of producing the semiconductor deviceNEC ELECTRONICS CORP·Filed 2001·Granted Nov 6, 2007·7 cites·14 claims
- 2052US8270177B2Electronic device and method for manufacturing electronic deviceUCHIDA KENJI·Filed 2008·Granted Sep 18, 2012·0 cites·20 claims
- 2151US8986588B2Electronic device and process for manufacturing electronic deviceUCHIDA KENJI·Filed 2012·Granted Mar 24, 2015·0 cites·14 claims
- 2250US6555763B1Multilayered circuit board for semiconductor chip module, and method of manufacturing the sameFUCHIGAMI MICRO CO·Filed 1999·Granted Apr 29, 2003·21 cites·15 claims
- 2349US9327457B2Electronic device and method for manufacturing electronic deviceUCHIDA KENJI·Filed 2012·Granted May 3, 2016·0 cites·20 claims
- 2448US10267489B2Light-emitting apparatusCITIZEN ELECTRONICS·Filed 2016·Granted Apr 23, 2019·0 cites·9 claims
- 2548US6829266B2Optical semiconductor device increasing productivity and method of fabricating the sameNEC COMPOUND SEMICONDUCTOR·Filed 2003·Granted Dec 7, 2004·3 cites·33 claims
- 2648US2010096717A1Electronic device and process for manufacturing electronic deviceNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 2748US2012286437A1Electronic device and method of manufacturing the electronic deviceUCHIDA KENJI·Filed 2012·Application pending·0 cites
- 2847US7236373B2Electronic device capable of preventing electromagnetic wave from being radiatedHITACHI CABLE·Filed 2003·Granted Jun 26, 2007·4 cites·10 claims
- 2947US2006225918A1Electronic device substrate and its fabrication method, and electronic device and its fabrication methodNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 3041US11145795B2Light emitting apparatus and method for manufacturing sameCITIZEN ELECTRONICS·Filed 2017·Granted Oct 12, 2021·0 cites·6 claims
- 3140US10181553B2Semiconductor device and method for producing the sameCITIZEN ELECTRONICS·Filed 2015·Granted Jan 15, 2019·0 cites·18 claims
- 3238US10714460B2Light emitting device and manufacturing method thereofCITIZEN ELECTRONICS·Filed 2016·Granted Jul 14, 2020·0 cites·4 claims
- 3335US2018040780A1Light-emitting device and method for producing the sameCITIZEN ELECTRONICS·Filed 2016·Application pending·0 cites
- 3432US2003197250A1Semiconductor device and method of fabricating the sameNEC COMPOUND SEMICONDUCTOR·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →