Surface-mount light emitting device

Abstract

A surface-mount light emitting device is provided comprising a light emitting element ( 2 ), a reflector ( 1 ) which is molded integral with a leadframe ( 11, 12 ) having the light emitting element mounted thereon, and an encapsulating resin composition ( 4 ). The reflector is molded from a heat curable resin composition to define a recess with bottom and side walls. The resin side wall has a thickness of 50-500 μm. The encapsulating resin composition is a heat curable resin composition having a hardness of 30-70 Shore D units in the cured state.

1 . A surface-mount light emitting device comprising
 a light emitting element,   a reflector which is molded integral with a first lead having the light emitting element mounted thereon and a second lead in electrical connection with the light emitting element, and   an encapsulating resin composition in the cured state enclosing the light emitting element, wherein   said reflector is molded from a heat curable resin composition and has a recess defined by a bottom wall and a side wall, the resin side wall has a thickness of 50 to 500 μm, and   the encapsulating resin composition is a heat curable resin composition having a hardness of at least 30 Shore D units in the cured state.   
     
     
         2 . The light emitting device of  claim 1  wherein said reflector is molded from a curable epoxy resin composition, silicone resin composition or silicone/epoxy hybrid resin composition. 
     
     
         3 . The light emitting device of  claim 1  wherein the encapsulating resin composition is a curable silicone resin composition or silicone/epoxy hybrid resin composition.