Structure and process of heat dissipation substrate

Abstract

Structure of a heat dissipation substrate including a metal substrate, a first insulating material, a second insulating material, a first patterned conductive layer and a second patterned conductive layer is provided. The metal substrate has an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface and a plurality of second recesses located on the lower surface. The first insulating material is provided to fill into the first recesses. The second insulating material is provided to fill into the second recesses. The first patterned conductive layer is disposed on the upper surface of the metal substrate and a portion of the first insulating material. The second patterned conductive layer is disposed on the lower surface of the metal substrate and a portion of the second insulating material.

1 . A process of fabricating a heat dissipation substrate, the process comprising:
 providing a metal substrate having an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface, and a plurality of second recesses located on the lower surface, wherein the metal substrate is divided into a plurality of carrier units and a plurality of connecting units connecting the carrier units;   filling a first insulating material into the first recesses and a second insulating material into the second recesses;   forming a first conductive layer on the upper surface of the metal substrate and the first insulating material and a second conductive layer on the lower surface of the metal substrate and the second insulating material;   patterning the first conductive layer and the second conductive layer to form a first patterned conductive layer and a second patterned conductive layer; and   taking the first insulating material and the second insulating material as an etching mask to etch the connecting units of the metal substrate so as to form a plurality of individual heat dissipation substrates.   
     
     
         2 . The process of fabricating the heat dissipation substrate as claimed in  claim 1 , wherein a method of forming the first recesses and the second recesses comprises an etching. 
     
     
         3 . The process of fabricating the heat dissipation substrate as claimed in  claim 1 , wherein a method of forming the first conductive layer and the second conductive layer comprises an electroplating. 
     
     
         4 . The process of fabricating the heat dissipation substrate as claimed in  claim 1 , wherein the metal substrate has a thickness less than 0.6 millimeter (mm). 
     
     
         5 . A structure of the heat dissipation substrate fabricated using the process for fabricating the heat dissipation substrate as claimed in  claim 1 , the structure comprising:
 a metal substrate having an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface, and a plurality of second recesses located on the lower surface;   a first insulating material filled into the first recesses;   a second insulating material filled into the second recesses;   a first patterned conductive layer disposed on the upper surface of the metal substrate and a portion of the first insulating material; and   a second patterned conductive layer disposed on the lower surface of the metal substrate and a portion of the second insulating material.   
     
     
         6 . The structure of the heat dissipation substrate as claimed in  claim 5 , wherein the first insulating material substantially aligns with the upper surface of the metal substrate. 
     
     
         7 . The structure of the heat dissipation substrate as claimed in  claim 5 , wherein the second insulating material substantially aligns with the lower surface of the metal substrate. 
     
     
         8 . The structure of the heat dissipation substrate as claimed in  claim 5 , wherein the metal substrate has a thickness less than 0.6 mm. 
     
     
         9 . The structure of the heat dissipation substrate as claimed in  claim 5 , wherein a material of the metal substrate comprises copper, and the first insulating material and the second insulating material comprise a glass fiber film.